Abstract
Full characterization of the three-dimensional structures resulting from the directed self-assembly (DSA) of block copolymers (BCP) remains a difficult challenge. Transmission electron microscope (TEM) tomography and resonant soft x-ray scattering have emerged as powerful and complementary methods for through-film characterization; both techniques require samples to be prepared on specialized membrane substrates. Here we report a generalizable process to implement BCP DSA with density multiplication on silicon nitride membranes. A key feature of the process developed here is that it does not introduce any artefacts or damage to the polymer assemblies as DSA is performed prior to back-etched membrane formation. Because most research and applications of BCP lithography are based on silicon substrates, process variations introduced by implementing DSA on a silicon nitride/silicon stack versus silicon were identified and mitigated. Using full-wafers, membranes were fabricated with different sizes and layouts to enable both TEM and x-ray characterization. Finally, both techniques were used to characterize structures resulting from the DSA of lamella-forming BCP with density multiplication.
Original language | English (US) |
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Article number | 435303 |
Journal | Nanotechnology |
Volume | 27 |
Issue number | 43 |
DOIs | |
State | Published - Sep 23 2016 |
All Science Journal Classification (ASJC) codes
- Bioengineering
- General Chemistry
- General Materials Science
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering