Power distribution networks for system-on-package: Status and challenges

Madhavan Swaminathan, Joungho Kim, Istvan Novak, James P. Libous

Research output: Contribution to journalArticlepeer-review

244 Scopus citations


The power consumption of microprocessors is increasing at an alarming rate leading to 2X reduction in the power distribution impedance for every product generation. In the last decade, high I/O ball grid array (BGA) packages have replaced quad flat pack (QFP) packages for lowering the inductance. Similarly, multilayered printed circuit boards loaded with decoupling capacitors are being used to meet the target impedance. With the trend toward system-on-package (SOP) architectures, the power distribution needs can only increase, further reducing the target impedance and increasing the isolation characteristics required. This paper provides an overview on the design of power distribution networks for digital and mixed-signal systems with emphasis on design tools, decoupling, measurements, and emerging technologies.

Original languageEnglish (US)
Pages (from-to)286-300
Number of pages15
JournalIEEE Transactions on Advanced Packaging
Issue number2
StatePublished - May 2004

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering


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