TY - GEN
T1 - Practical aspects of modeling apertures for signal and power integrity co-simulation
AU - Choi, Jae Young
AU - Swaminathan, Madhavan
PY - 2011
Y1 - 2011
N2 - When the return path of a signal is not continuous, unwanted noise will couple to the return current, leading to worsening of the signal waveform. To prevent such a signal integrity issue, a thorough understanding of the physics of the return path discontinuity (RPD) is critical. This paper presents analysis and quantification of the impact of RPDs in the presence of a power delivery network. The study of the different types of RPDs, such as a gap between reference planes and an aperture, provides designing and modeling guidelines. The guidelines are applied to an efficient PDN analysis method to further improve computational efficiency.
AB - When the return path of a signal is not continuous, unwanted noise will couple to the return current, leading to worsening of the signal waveform. To prevent such a signal integrity issue, a thorough understanding of the physics of the return path discontinuity (RPD) is critical. This paper presents analysis and quantification of the impact of RPDs in the presence of a power delivery network. The study of the different types of RPDs, such as a gap between reference planes and an aperture, provides designing and modeling guidelines. The guidelines are applied to an efficient PDN analysis method to further improve computational efficiency.
UR - http://www.scopus.com/inward/record.url?scp=84855370731&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84855370731&partnerID=8YFLogxK
U2 - 10.1109/EPEPS.2011.6100171
DO - 10.1109/EPEPS.2011.6100171
M3 - Conference contribution
AN - SCOPUS:84855370731
SN - 9781424493999
T3 - 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
SP - 7
EP - 10
BT - 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
T2 - 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
Y2 - 23 October 2011 through 26 October 2011
ER -