Predictive modeling of permeation for flexible packaging applications using finite element analysis

William J. Calvo, Brian A. Young, Paul E. Koch

Research output: Contribution to conference › Paper › peer-review

Original language	English (US)
Pages	531-555
Number of pages	25
State	Published - 2004
Event	Flexible Packaging Conference 2004 - Atlanta, GA, United States Duration: Mar 24 2004 → Mar 26 2004

Other	Flexible Packaging Conference 2004
Country/Territory	United States
City	Atlanta, GA
Period	3/24/04 → 3/26/04

All Science Journal Classification (ASJC) codes

@conference{28b99af36bac4cbeac1d30a0596872ec,

title = "Predictive modeling of permeation for flexible packaging applications using finite element analysis",

author = "Calvo, {William J.} and Young, {Brian A.} and Koch, {Paul E.}",

year = "2004",

language = "English (US)",

pages = "531--555",

note = "Flexible Packaging Conference 2004 ; Conference date: 24-03-2004 Through 26-03-2004",

}

TY - CONF

T1 - Predictive modeling of permeation for flexible packaging applications using finite element analysis

AU - Calvo, William J.

AU - Young, Brian A.

AU - Koch, Paul E.

PY - 2004

Y1 - 2004

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UR - http://www.scopus.com/inward/citedby.url?scp=30644481130&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:30644481130

SP - 531

EP - 555

T2 - Flexible Packaging Conference 2004

Y2 - 24 March 2004 through 26 March 2004

ER -