TY - GEN
T1 - Preliminary Application of Deep Learning to Design Space Exploration
AU - Roy, Kallol
AU - Mert, Hakki Torun
AU - Swaminathan, Madhavan
N1 - Funding Information:
ACKNOWLEDGEMENT This research is funded by the DARPA CHIPS project under Award N00014-17-1-2950.
Publisher Copyright:
© 2018 IEEE.
PY - 2018/7/2
Y1 - 2018/7/2
N2 - The increasing trend towards higher performance electronic systems has led to various challenges in design space exploration. Often times, interconnects in such systems are analyzed using CPU intensive fullwave EM simulations, making parameter sweeps in a very large design space impractical. In this paper, we propose using Deep Neural Networks (DNN) as a solution to cover the large design space using their generalization capability, i.e., predicting outside the range of training data. We show the performance of the proposed method on predicting the frequency dependent RLGC matrices of a multi-conductor microstrip transmission line.
AB - The increasing trend towards higher performance electronic systems has led to various challenges in design space exploration. Often times, interconnects in such systems are analyzed using CPU intensive fullwave EM simulations, making parameter sweeps in a very large design space impractical. In this paper, we propose using Deep Neural Networks (DNN) as a solution to cover the large design space using their generalization capability, i.e., predicting outside the range of training data. We show the performance of the proposed method on predicting the frequency dependent RLGC matrices of a multi-conductor microstrip transmission line.
UR - http://www.scopus.com/inward/record.url?scp=85064605447&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85064605447&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2018.8680888
DO - 10.1109/EDAPS.2018.8680888
M3 - Conference contribution
AN - SCOPUS:85064605447
T3 - IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018
BT - IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018
Y2 - 16 December 2018 through 18 December 2018
ER -