TY - GEN
T1 - Pressure Sensitive Aluminum Nitride Drumhead Resonators
AU - Gangaraj, Seyyed Mojtaba Hassani
AU - Chauhan, Tanya
AU - Park, Mingyo
AU - Ansari, Azadeh
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025
Y1 - 2025
N2 - This work reports on the highly-sensitive frequency modulation of a piezoelectrically-actuated Aluminum Nitride (AlN) resonant pressure sensor. We show that the resonance frequency of a drumhead mode with a 300 nm cavity, in pressure equilibrium with the ambient environment, linearly increases with increasing pressure up to 33kPa. The membrane stiffening with increased ambient pressure is due to the added restoring force applied to the membrane by the gas trapped in the cavity. Experimental results show that the resonance frequency linearly increases from 3.66 MHz to 3.72 MHz as the pressure increases from 500 Pa to 33 kPa, resulting in a f vs. p sensitivity of 0.5 ppm/Pa. By eliminating the need for a vacuum or stable reference cavity common in differential pressure sensors, our absolute pressure sensor is a more reliable candidate for long-term measurements, static and dynamic pressures and under high pressure loads.
AB - This work reports on the highly-sensitive frequency modulation of a piezoelectrically-actuated Aluminum Nitride (AlN) resonant pressure sensor. We show that the resonance frequency of a drumhead mode with a 300 nm cavity, in pressure equilibrium with the ambient environment, linearly increases with increasing pressure up to 33kPa. The membrane stiffening with increased ambient pressure is due to the added restoring force applied to the membrane by the gas trapped in the cavity. Experimental results show that the resonance frequency linearly increases from 3.66 MHz to 3.72 MHz as the pressure increases from 500 Pa to 33 kPa, resulting in a f vs. p sensitivity of 0.5 ppm/Pa. By eliminating the need for a vacuum or stable reference cavity common in differential pressure sensors, our absolute pressure sensor is a more reliable candidate for long-term measurements, static and dynamic pressures and under high pressure loads.
UR - https://www.scopus.com/pages/publications/105001659471
UR - https://www.scopus.com/pages/publications/105001659471#tab=citedBy
U2 - 10.1109/MEMS61431.2025.10917539
DO - 10.1109/MEMS61431.2025.10917539
M3 - Conference contribution
AN - SCOPUS:105001659471
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 861
EP - 864
BT - 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems, MEMS 2025
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 38th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2025
Y2 - 19 January 2025 through 23 January 2025
ER -