@inproceedings{2ffb0406c85445c5807e9ede65b9978b,
title = "Printed circuit board assembly/soldering initiatives at Penn State",
abstract = "Surface mount technology (SMT) is having a significant impact in the printed circuit board industry given implications of this technology on component size/weight considerations, board density, assembly and testing. Large segments of the industry are converting from through hole technology to surface mount and engineers find they have to master new processes and keep informed of new developments. With initial support from the AT&T Manufacturing Foundation and current support from the National Science Foundation, the Industrial Engineering Department at Penn State has developed a laboratory to support most processes required for assembly of printed circuit boards with mixed technology. This paper provides a brief description of two recent educational initiatives involving this technology as well as other aspects of electronic manufacturing.",
author = "Lehtihet, {E. A.}",
year = "1992",
month = jan,
day = "1",
doi = "10.1109/IEMT.1992.639884",
language = "English (US)",
series = "13th IEEE/CHMT International Electronics Manufacturing Technology Symposium - Integrated Manufacturing: The Future Is Now, IEMT 1992",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "169--173",
booktitle = "13th IEEE/CHMT International Electronics Manufacturing Technology Symposium - Integrated Manufacturing",
address = "United States",
note = "13th IEEE/CHMT International Electronics Manufacturing Technology Symposium, IEMT 1992 ; Conference date: 28-09-1992 Through 30-09-1992",
}