TY - GEN
T1 - Problems and solutions in dry wafer cleaning technology
AU - Ruzyllo, Jerzy
PY - 1993
Y1 - 1993
N2 - Dry wafer cleaning is emerging as a viable process technology. Still, there are some problems that need to be overcome in order for dry wafer cleaning to meet stringent requirements of advanced integrated circuits (IC) manufacturing. In this paper, problems that still need to be resolved in order to fully implement this surface treatment mode are identified and possible solutions are considered.
AB - Dry wafer cleaning is emerging as a viable process technology. Still, there are some problems that need to be overcome in order for dry wafer cleaning to meet stringent requirements of advanced integrated circuits (IC) manufacturing. In this paper, problems that still need to be resolved in order to fully implement this surface treatment mode are identified and possible solutions are considered.
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UR - http://www.scopus.com/inward/citedby.url?scp=0027806115&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:0027806115
SN - 1877862193
T3 - Proceedings, Annual Technical Meeting - Institute of Environmental Sciences
SP - 274
BT - Proceedings, Annual Technical Meeting - Institute of Environmental Sciences
A2 - Anon, null
PB - Publ by Inst of Environmental Sciences
T2 - Proceedings of the 39th Annual Technical Meeting of Institute of Environmental Sciences
Y2 - 2 May 1993 through 7 May 1993
ER -