Process design kit and design automation for flexible hybrid electronics

Tsung Ching Huang; Ting Lei; Leilai Shao; Sridhar Sivapurapu; Madhavan Swaminathan; Sicheng Li; Zhenan Bao; Kwang Ting Cheng; Raymond Beausoleil

doi:10.1109/VLSI-DAT.2019.8741745

Process design kit and design automation for flexible hybrid electronics

Tsung Ching Huang
, Ting Lei
, Leilai Shao
, Sridhar Sivapurapu
, Madhavan Swaminathan
, Sicheng Li
, Zhenan Bao
, Kwang Ting Cheng
, Raymond Beausoleil

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

High-performance low-cost flexible hybrid electronics (FHE) are desirable for applications such as internet of things (IoT) and wearable electronics. Carbon-nanotube (CNT) thin-film transistor (TFT) is a promising candidate for high-performance FHE, because of its high carrier mobility, superior mechanical flexibility, and material compatibility with low-cost printing and solution-processes. Flexible sensors and peripheral CNT-TFT circuits, such as decoders, drivers and sense amplifiers, can be printed and hybrid-integrated with thinned (<50μm) silicon chips on soft, thin, and flexible substrates for a wide range of applications from flexible displays to wearable medical devices. Here we report: 1) process design kit (PDK) to enable FHE design automation for large-scale FHE circuits, and 2) solution-process proven intellectual property (IP) blocks for TFT circuits design, including Pseudo-CMOS [1] flexible digital logic and analog amplifiers shown in Figure 1.

Original language	English (US)
Title of host publication	2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728106557
DOIs	https://doi.org/10.1109/VLSI-DAT.2019.8741745
State	Published - Apr 2019
Event	2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019 - Hsinchu, Taiwan, Province of China Duration: Apr 22 2019 → Apr 25 2019

Publication series

Name	2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019

Conference

Conference	2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019
Country/Territory	Taiwan, Province of China
City	Hsinchu
Period	4/22/19 → 4/25/19

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Instrumentation
Computer Networks and Communications
Hardware and Architecture

Access to Document

10.1109/VLSI-DAT.2019.8741745

Cite this

Huang, T. C., Lei, T., Shao, L., Sivapurapu, S., Swaminathan, M., Li, S., Bao, Z., Cheng, K. T., & Beausoleil, R. (2019). Process design kit and design automation for flexible hybrid electronics. In 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019 Article 8741745 (2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/VLSI-DAT.2019.8741745

@inproceedings{2b6fc1ed8de44f7f9f09e6420d78f1a6,

title = "Process design kit and design automation for flexible hybrid electronics",

abstract = "High-performance low-cost flexible hybrid electronics (FHE) are desirable for applications such as internet of things (IoT) and wearable electronics. Carbon-nanotube (CNT) thin-film transistor (TFT) is a promising candidate for high-performance FHE, because of its high carrier mobility, superior mechanical flexibility, and material compatibility with low-cost printing and solution-processes. Flexible sensors and peripheral CNT-TFT circuits, such as decoders, drivers and sense amplifiers, can be printed and hybrid-integrated with thinned (<50μm) silicon chips on soft, thin, and flexible substrates for a wide range of applications from flexible displays to wearable medical devices. Here we report: 1) process design kit (PDK) to enable FHE design automation for large-scale FHE circuits, and 2) solution-process proven intellectual property (IP) blocks for TFT circuits design, including Pseudo-CMOS [1] flexible digital logic and analog amplifiers shown in Figure 1.",

author = "Huang, \{Tsung Ching\} and Ting Lei and Leilai Shao and Sridhar Sivapurapu and Madhavan Swaminathan and Sicheng Li and Zhenan Bao and Cheng, \{Kwang Ting\} and Raymond Beausoleil",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019 ; Conference date: 22-04-2019 Through 25-04-2019",

year = "2019",

month = apr,

doi = "10.1109/VLSI-DAT.2019.8741745",

language = "English (US)",

series = "2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019",

address = "United States",

}

Huang, TC, Lei, T, Shao, L, Sivapurapu, S, Swaminathan, M, Li, S, Bao, Z, Cheng, KT & Beausoleil, R 2019, Process design kit and design automation for flexible hybrid electronics. in 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019., 8741745, 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019, Institute of Electrical and Electronics Engineers Inc., 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019, Hsinchu, Taiwan, Province of China, 4/22/19. https://doi.org/10.1109/VLSI-DAT.2019.8741745

Process design kit and design automation for flexible hybrid electronics. / Huang, Tsung Ching; Lei, Ting; Shao, Leilai et al.
2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 8741745 (2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Huang, Tsung Ching

AU - Lei, Ting

AU - Shao, Leilai

AU - Sivapurapu, Sridhar

AU - Swaminathan, Madhavan

AU - Li, Sicheng

AU - Bao, Zhenan

AU - Cheng, Kwang Ting

AU - Beausoleil, Raymond

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N2 - High-performance low-cost flexible hybrid electronics (FHE) are desirable for applications such as internet of things (IoT) and wearable electronics. Carbon-nanotube (CNT) thin-film transistor (TFT) is a promising candidate for high-performance FHE, because of its high carrier mobility, superior mechanical flexibility, and material compatibility with low-cost printing and solution-processes. Flexible sensors and peripheral CNT-TFT circuits, such as decoders, drivers and sense amplifiers, can be printed and hybrid-integrated with thinned (<50μm) silicon chips on soft, thin, and flexible substrates for a wide range of applications from flexible displays to wearable medical devices. Here we report: 1) process design kit (PDK) to enable FHE design automation for large-scale FHE circuits, and 2) solution-process proven intellectual property (IP) blocks for TFT circuits design, including Pseudo-CMOS [1] flexible digital logic and analog amplifiers shown in Figure 1.

AB - High-performance low-cost flexible hybrid electronics (FHE) are desirable for applications such as internet of things (IoT) and wearable electronics. Carbon-nanotube (CNT) thin-film transistor (TFT) is a promising candidate for high-performance FHE, because of its high carrier mobility, superior mechanical flexibility, and material compatibility with low-cost printing and solution-processes. Flexible sensors and peripheral CNT-TFT circuits, such as decoders, drivers and sense amplifiers, can be printed and hybrid-integrated with thinned (<50μm) silicon chips on soft, thin, and flexible substrates for a wide range of applications from flexible displays to wearable medical devices. Here we report: 1) process design kit (PDK) to enable FHE design automation for large-scale FHE circuits, and 2) solution-process proven intellectual property (IP) blocks for TFT circuits design, including Pseudo-CMOS [1] flexible digital logic and analog amplifiers shown in Figure 1.

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M3 - Conference contribution

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BT - 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019

PB - Institute of Electrical and Electronics Engineers Inc.

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Y2 - 22 April 2019 through 25 April 2019

ER -

Huang TC, Lei T, Shao L, Sivapurapu S, Swaminathan M, Li S et al. Process design kit and design automation for flexible hybrid electronics. In 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8741745. (2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019). doi: 10.1109/VLSI-DAT.2019.8741745

Process design kit and design automation for flexible hybrid electronics

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All Science Journal Classification (ASJC) codes

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