TY - GEN
T1 - Process Design Kit and Design Automation for Flexible Hybrid Electronics
AU - Huang, Tsung Ching
AU - Lei, Ting
AU - Shao, Leilai
AU - Sivapurapu, Sridhar
AU - Swaminathan, Madhavan
AU - Li, Sicheng
AU - Bao, Zhenan
AU - Cheng, Kwang Ting
AU - Beausoleil, Raymond
N1 - Publisher Copyright:
© 2019 EDAA.
PY - 2019/5/14
Y1 - 2019/5/14
N2 - High-performance low-cost flexible hybrid electronics (FHE) are desirable for internet of things (IoT). Carbon-nanotube (CNT) thin-film transistor (TFT) is a promising candidate for high-performance FHE because of its high carrier mobility (25cm2/V.s), superior mechanical flexibility/stretchability, and material compatibility with low-cost printing and solution processes. Flexible sensors and peripheral CNT-TFT circuits, such as decoders, drivers and sense amplifiers, can be printed and integrated with thinned (<50μm) silicon chips on soft, thin, and flexible substrates for appealing product designs and form factors. Here we report: 1) process design kit (PDK) to enable FHE design automation, from device modeling to physical verification, and 2) open-source and solution-process proven intellectual property (IP) blocks, including Pseudo-CMOS [1] digital logic and analog amplifiers on flexible substrates, as shown in Figure 1. The proposed FHE-PDK and circuit design IP are fully compatible with silicon design EDA tools, and can be readily used for co-design with both CNT-TFT circuits and silicon chips.
AB - High-performance low-cost flexible hybrid electronics (FHE) are desirable for internet of things (IoT). Carbon-nanotube (CNT) thin-film transistor (TFT) is a promising candidate for high-performance FHE because of its high carrier mobility (25cm2/V.s), superior mechanical flexibility/stretchability, and material compatibility with low-cost printing and solution processes. Flexible sensors and peripheral CNT-TFT circuits, such as decoders, drivers and sense amplifiers, can be printed and integrated with thinned (<50μm) silicon chips on soft, thin, and flexible substrates for appealing product designs and form factors. Here we report: 1) process design kit (PDK) to enable FHE design automation, from device modeling to physical verification, and 2) open-source and solution-process proven intellectual property (IP) blocks, including Pseudo-CMOS [1] digital logic and analog amplifiers on flexible substrates, as shown in Figure 1. The proposed FHE-PDK and circuit design IP are fully compatible with silicon design EDA tools, and can be readily used for co-design with both CNT-TFT circuits and silicon chips.
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U2 - 10.23919/DATE.2019.8714975
DO - 10.23919/DATE.2019.8714975
M3 - Conference contribution
AN - SCOPUS:85066635076
T3 - Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
SP - 36
EP - 41
BT - Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
Y2 - 25 March 2019 through 29 March 2019
ER -