Process design kit and design automation for flexible hybrid electronics

  • Tsung Ching Huang
  • , Ting Lei
  • , Leilai Shao
  • , Sridhar Sivapurapu
  • , Madhavan Swaminathan
  • , Sicheng Li
  • , Zhenan Bao
  • , Kwang Ting Cheng
  • , Raymond Beausoleil

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

High-performance low-cost flexible hybrid electronics (FHE) are desirable for applications such as internet of things (IoT) and wearable electronics. Carbon-nanotube (CNT) thin-film transistor (TFT) is a promising candidate for high-performance FHE, because of its high carrier mobility, superior mechanical flexibility, and material compatibility with low-cost printing and solution-processes. Flexible sensors and peripheral CNT-TFT circuits, such as decoders, drivers and sense amplifiers, can be printed and hybrid-integrated with thinned (<50µm) silicon chips on soft, thin, and flexible substrates for a wide range of applications from flexible displays to wearable medical devices. Here we report: 1) process design kit (PDK) to enable FHE design automation for large-scale FHE circuits, and 2) solution-process proven intellectual property (IP) blocks for TFT circuits design, including Pseudo-CMOS [1] flexible digital logic and analog amplifiers shown in Figure 1. The FHE-PDK is fully compatible with silicon design tools for hybrid-integrated flexible circuits.

Original languageEnglish (US)
Title of host publicationDigest of Technical Papers - SID International Symposium
EditorsKelly Jean Fitzsimmons
PublisherJohn Wiley and Sons Inc.
Pages217-220
Number of pages4
EditionBook 1
ISBN (Electronic)9781510896161, 9781510896161, 9781510896161
DOIs
StatePublished - 2019
EventSID Symposium, Seminar, and Exhibition 2019, Display Week 2019 - San Jose, United States
Duration: May 12 2019May 17 2019

Publication series

NameDigest of Technical Papers - SID International Symposium
NumberBook 1
Volume50
ISSN (Print)0097-966X
ISSN (Electronic)2168-0159

Conference

ConferenceSID Symposium, Seminar, and Exhibition 2019, Display Week 2019
Country/TerritoryUnited States
CitySan Jose
Period5/12/195/17/19

All Science Journal Classification (ASJC) codes

  • General Engineering

Fingerprint

Dive into the research topics of 'Process design kit and design automation for flexible hybrid electronics'. Together they form a unique fingerprint.

Cite this