TY - JOUR
T1 - Reaction kinetics and thermal properties of epoxidised cresol novolac/4,4'-diglycidyl (3,3',5,5'-tetramethylbiphenyl) epoxy resin composite cured with aromatic diamine
AU - Liu, Zhongguo
AU - Zhang, Gang
AU - Tu, Kuifeng
AU - Zhao, Sen
AU - Han, Miaomiao
AU - Ni, Jing
AU - Ma, Wenjia
AU - Na, Hui
PY - 2011/10
Y1 - 2011/10
N2 - A series of novel composites based on different ratios of epoxidised cresol novolac (ECN) and 4,4'-diglycidyl(3,3',5,5'-tetramethylbiphenyl) epoxy resin (TMBP) have been prepared with the curing agent 4,4'-methylenediamine (DDM) and 4,4'-diaminodiphenylsulfone (DDS), respectively. The investigation of cure kinetics was performed by differential scanning calorimetry using an isoconversional method. The high thermal stabilities of the cured samples were also studied by thermogravimetric analysis. In addition, no phase separation was observed for cured ECN/DDM and ECN/DDS blending with different amounts of TMBP by dynamic mechanical analysis and scanning electron microscopy. Moreover, the cured systems also exhibited excellent impact properties and low moisture absorption. All the results indicate that the ECN/TMBP/DDM and ECN/TMBP/DDS systems are promising materials in electronic packaging.
AB - A series of novel composites based on different ratios of epoxidised cresol novolac (ECN) and 4,4'-diglycidyl(3,3',5,5'-tetramethylbiphenyl) epoxy resin (TMBP) have been prepared with the curing agent 4,4'-methylenediamine (DDM) and 4,4'-diaminodiphenylsulfone (DDS), respectively. The investigation of cure kinetics was performed by differential scanning calorimetry using an isoconversional method. The high thermal stabilities of the cured samples were also studied by thermogravimetric analysis. In addition, no phase separation was observed for cured ECN/DDM and ECN/DDS blending with different amounts of TMBP by dynamic mechanical analysis and scanning electron microscopy. Moreover, the cured systems also exhibited excellent impact properties and low moisture absorption. All the results indicate that the ECN/TMBP/DDM and ECN/TMBP/DDS systems are promising materials in electronic packaging.
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U2 - 10.1002/pi.3119
DO - 10.1002/pi.3119
M3 - Article
AN - SCOPUS:80052883725
SN - 0959-8103
VL - 60
SP - 1556
EP - 1562
JO - Polymer International
JF - Polymer International
IS - 10
ER -