Reaction kinetics, thermal properties of tetramethyl biphenyl epoxy resin cured with aromatic diamine

Tiezhu Fu; Gang Zhang; Shuangling Zhong; Chengji Zhao; Ke Shao; Lifeng Wang; Hui Na

doi:10.1002/app.26340

Reaction kinetics, thermal properties of tetramethyl biphenyl epoxy resin cured with aromatic diamine

Tiezhu Fu, Gang Zhang, Shuangling Zhong, Chengji Zhao, Ke Shao, Lifeng Wang, Hui Na

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

21 Scopus citations

Abstract

Epoxy resins, 4, 4′-diglycidyl (3, 3′, 5, 5′- tetramethylbiphenyl) epoxy resin (TMBP) containing rigid rod structure as a class of high performance polymers has been researched. The investigation of cure kinetics of TMBP and diglycidyl ether of bisphenol-A epoxy resin (DGEBA) cured with p-phenylenediamine (PDA) was performed by differential scanning calorimeter using an isoconversional method with dynamic conditions. The effect of the molar ratios of TMBP to PDA on the cure reaction kinetics was studied. The results showed that the curing of epoxy resins contains different stages. The activation energy was dependent of the degree of conversion. At the early of curing stages, the activation energy showed the activation energy took as maximum value. The effects of rigid rod groups and molar ratios of TMBP to PDA for the thermal properties were investigated by the DSC, DMA and TGA. The cured 2/1 TMBP/PDA system with rigid rod groups and high crosslink density had shown highest T_g and thermal degradation temperature.

Original language	English (US)
Pages (from-to)	2611-2620
Number of pages	10
Journal	Journal of Applied Polymer Science
Volume	105
Issue number	5
DOIs	https://doi.org/10.1002/app.26340
State	Published - Sep 5 2007

All Science Journal Classification (ASJC) codes

Chemistry(all)
Surfaces, Coatings and Films
Polymers and Plastics
Materials Chemistry

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10.1002/app.26340

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title = "Reaction kinetics, thermal properties of tetramethyl biphenyl epoxy resin cured with aromatic diamine",

abstract = "Epoxy resins, 4, 4′-diglycidyl (3, 3′, 5, 5′- tetramethylbiphenyl) epoxy resin (TMBP) containing rigid rod structure as a class of high performance polymers has been researched. The investigation of cure kinetics of TMBP and diglycidyl ether of bisphenol-A epoxy resin (DGEBA) cured with p-phenylenediamine (PDA) was performed by differential scanning calorimeter using an isoconversional method with dynamic conditions. The effect of the molar ratios of TMBP to PDA on the cure reaction kinetics was studied. The results showed that the curing of epoxy resins contains different stages. The activation energy was dependent of the degree of conversion. At the early of curing stages, the activation energy showed the activation energy took as maximum value. The effects of rigid rod groups and molar ratios of TMBP to PDA for the thermal properties were investigated by the DSC, DMA and TGA. The cured 2/1 TMBP/PDA system with rigid rod groups and high crosslink density had shown highest Tg and thermal degradation temperature.",

author = "Tiezhu Fu and Gang Zhang and Shuangling Zhong and Chengji Zhao and Ke Shao and Lifeng Wang and Hui Na",

year = "2007",

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doi = "10.1002/app.26340",

language = "English (US)",

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T1 - Reaction kinetics, thermal properties of tetramethyl biphenyl epoxy resin cured with aromatic diamine

AU - Fu, Tiezhu

AU - Zhang, Gang

AU - Zhong, Shuangling

AU - Zhao, Chengji

AU - Shao, Ke

AU - Wang, Lifeng

AU - Na, Hui

PY - 2007/9/5

Y1 - 2007/9/5

N2 - Epoxy resins, 4, 4′-diglycidyl (3, 3′, 5, 5′- tetramethylbiphenyl) epoxy resin (TMBP) containing rigid rod structure as a class of high performance polymers has been researched. The investigation of cure kinetics of TMBP and diglycidyl ether of bisphenol-A epoxy resin (DGEBA) cured with p-phenylenediamine (PDA) was performed by differential scanning calorimeter using an isoconversional method with dynamic conditions. The effect of the molar ratios of TMBP to PDA on the cure reaction kinetics was studied. The results showed that the curing of epoxy resins contains different stages. The activation energy was dependent of the degree of conversion. At the early of curing stages, the activation energy showed the activation energy took as maximum value. The effects of rigid rod groups and molar ratios of TMBP to PDA for the thermal properties were investigated by the DSC, DMA and TGA. The cured 2/1 TMBP/PDA system with rigid rod groups and high crosslink density had shown highest Tg and thermal degradation temperature.

AB - Epoxy resins, 4, 4′-diglycidyl (3, 3′, 5, 5′- tetramethylbiphenyl) epoxy resin (TMBP) containing rigid rod structure as a class of high performance polymers has been researched. The investigation of cure kinetics of TMBP and diglycidyl ether of bisphenol-A epoxy resin (DGEBA) cured with p-phenylenediamine (PDA) was performed by differential scanning calorimeter using an isoconversional method with dynamic conditions. The effect of the molar ratios of TMBP to PDA on the cure reaction kinetics was studied. The results showed that the curing of epoxy resins contains different stages. The activation energy was dependent of the degree of conversion. At the early of curing stages, the activation energy showed the activation energy took as maximum value. The effects of rigid rod groups and molar ratios of TMBP to PDA for the thermal properties were investigated by the DSC, DMA and TGA. The cured 2/1 TMBP/PDA system with rigid rod groups and high crosslink density had shown highest Tg and thermal degradation temperature.

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Reaction kinetics, thermal properties of tetramethyl biphenyl epoxy resin cured with aromatic diamine

Abstract

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