Recent advances in electromagnetic compatibility of 3D-ICS - Part II

Etienne Sicard; Wu Jianfei; Rongjun Shen; Er Ping Li; En Xiao Liu; Joungho Kim; Jonghyun Cho; Madhavan Swaminathan

doi:10.1109/MEMC.2016.7477137

Recent advances in electromagnetic compatibility of 3D-ICS - Part II

Etienne Sicard, Wu Jianfei, Rongjun Shen, Er Ping Li, En Xiao Liu, Joungho Kim, Jonghyun Cho, Madhavan Swaminathan

Electrical Engineering

Research output: Contribution to specialist publication › Article

12 Scopus citations

Abstract

This second part addresses a selection of topics related to Electromagnetic interference (EMI) issues in three-dimensional integrated components. Details about Through Silicon Via (TSV) technology, modelling and parasitic effects are introduced in the first part, then key concepts such as signal integrity (SI), power integrity (PI), and Electromagnetic Interference are introduced.

Original language	English (US)
Pages	65-74
Number of pages	10
Volume	5
No	1
Specialist publication	IEEE Electromagnetic Compatibility Magazine
DOIs	https://doi.org/10.1109/MEMC.2016.7477137
State	Published - Jan 1 2016

All Science Journal Classification (ASJC) codes

Software
Signal Processing
Instrumentation
Computer Networks and Communications
Electrical and Electronic Engineering

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10.1109/MEMC.2016.7477137

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abstract = "This second part addresses a selection of topics related to Electromagnetic interference (EMI) issues in three-dimensional integrated components. Details about Through Silicon Via (TSV) technology, modelling and parasitic effects are introduced in the first part, then key concepts such as signal integrity (SI), power integrity (PI), and Electromagnetic Interference are introduced.",

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AU - Cho, Jonghyun

AU - Swaminathan, Madhavan

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Recent advances in electromagnetic compatibility of 3D-ICS - Part II

Abstract

All Science Journal Classification (ASJC) codes

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