Recent advances in electromagnetic compatibility of 3D-ICs - Part i

Etienne Sicard; Wu Jianfei; R. J. Shen; Er Ping Li; En Xiao Liu; J. Kim; Jonghyun Cho; Madhavan Swaminathan

doi:10.1109/MEMC.2015.7407186

Recent advances in electromagnetic compatibility of 3D-ICs - Part i

Etienne Sicard
, Wu Jianfei
, R. J. Shen
, Er Ping Li
, En Xiao Liu
, J. Kim
, Jonghyun Cho
, Madhavan Swaminathan

Electrical Engineering

Research output: Contribution to specialist publication › Article

16 Scopus citations

Abstract

Electromagnetic interference (EMI) issues are becoming crucial for three-dimensional integrated components which combine multi-core Systems-On-Chip, multi-band radio frequency circuits (RF), Giga-bit memories, as well as advanced analog circuits. In this first paper, the technology roadmap towards 3D-ICs is illustrated and the associated EMC challenges are described. This first paper also focuses on the role of interposers, associated electrical parasitics, and addresses concerns about signal and power integrity.

Original language	English (US)
Pages	79-89
Number of pages	11
Volume	4
No	4
Specialist publication	IEEE Electromagnetic Compatibility Magazine
DOIs	https://doi.org/10.1109/MEMC.2015.7407186
State	Published - Oct 1 2015

All Science Journal Classification (ASJC) codes

Software
Signal Processing
Instrumentation
Computer Networks and Communications
Electrical and Electronic Engineering

Access to Document

10.1109/MEMC.2015.7407186

Cite this

@misc{ffe12644375f4e0a86c6efefce9f55b3,

title = "Recent advances in electromagnetic compatibility of 3D-ICs - Part i",

abstract = "Electromagnetic interference (EMI) issues are becoming crucial for three-dimensional integrated components which combine multi-core Systems-On-Chip, multi-band radio frequency circuits (RF), Giga-bit memories, as well as advanced analog circuits. In this first paper, the technology roadmap towards 3D-ICs is illustrated and the associated EMC challenges are described. This first paper also focuses on the role of interposers, associated electrical parasitics, and addresses concerns about signal and power integrity.",

author = "Etienne Sicard and Wu Jianfei and Shen, \{R. J.\} and Li, \{Er Ping\} and Liu, \{En Xiao\} and J. Kim and Jonghyun Cho and Madhavan Swaminathan",

year = "2015",

month = oct,

day = "1",

doi = "10.1109/MEMC.2015.7407186",

language = "English (US)",

volume = "4",

pages = "79--89",

journal = "IEEE Electromagnetic Compatibility Magazine",

issn = "2162-2264",

publisher = "IEEE Electromagnetic Compatibility Society",

}

TY - GEN

T1 - Recent advances in electromagnetic compatibility of 3D-ICs - Part i

AU - Sicard, Etienne

AU - Jianfei, Wu

AU - Shen, R. J.

AU - Li, Er Ping

AU - Liu, En Xiao

AU - Kim, J.

AU - Cho, Jonghyun

AU - Swaminathan, Madhavan

PY - 2015/10/1

Y1 - 2015/10/1

N2 - Electromagnetic interference (EMI) issues are becoming crucial for three-dimensional integrated components which combine multi-core Systems-On-Chip, multi-band radio frequency circuits (RF), Giga-bit memories, as well as advanced analog circuits. In this first paper, the technology roadmap towards 3D-ICs is illustrated and the associated EMC challenges are described. This first paper also focuses on the role of interposers, associated electrical parasitics, and addresses concerns about signal and power integrity.

AB - Electromagnetic interference (EMI) issues are becoming crucial for three-dimensional integrated components which combine multi-core Systems-On-Chip, multi-band radio frequency circuits (RF), Giga-bit memories, as well as advanced analog circuits. In this first paper, the technology roadmap towards 3D-ICs is illustrated and the associated EMC challenges are described. This first paper also focuses on the role of interposers, associated electrical parasitics, and addresses concerns about signal and power integrity.

UR - https://www.scopus.com/pages/publications/84962684756

UR - https://www.scopus.com/pages/publications/84962684756#tab=citedBy

U2 - 10.1109/MEMC.2015.7407186

DO - 10.1109/MEMC.2015.7407186

M3 - Article

AN - SCOPUS:84962684756

SN - 2162-2264

VL - 4

SP - 79

EP - 89

JO - IEEE Electromagnetic Compatibility Magazine

JF - IEEE Electromagnetic Compatibility Magazine

ER -

Recent advances in electromagnetic compatibility of 3D-ICs - Part i

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this