TY - GEN
T1 - Reliability Modeling of Micro-vias in High-Density Redistribution Layers
AU - Nimbalkar, Pratik
AU - Kathaperumal, Mohanalingam
AU - Liu, Fuhan
AU - Swaminathan, Madhavan
AU - Tummala, Rao
N1 - Funding Information:
The authors would like to thank the members of the industry consortium at the 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA for their support and technical guidance.
Publisher Copyright:
© 2021 IEEE
PY - 2021
Y1 - 2021
N2 - The ever-increasing demand for high-bandwidth interconnects has given rise to the need for high IO-density package redistribution layers (RDL). This necessitates scaling down RDL critical dimensions as well as microvias. There are numerous challenges pertaining to scaling down microvias below 5 μm diameter. The main challenge is the thermomechanical reliability of vias in polymer dielectrics. Modeling and design for reliability in various polymer dielectrics is the key to achieve mechanical reliability. This paper presents a model for the prediction of micro-via failure. The effects of via geometry such as- via angle and height as well as material properties such as- CTE and elastic modulus on via failure are presented. Furthermore, modeling results are correlated with experimental results to verify the accuracy of the model. Using this model, it was determined that the conventional via geometry reaches an engineering limit at 2 μm of via diameter. Below this size, it becomes difficult to achieve reliable vias in polymers as they do not survive 1000 thermal cycles. Based on the modeling studies, a novel method is proposed for enhancement of reliability of vias below the engineering limit of 2 μm.
AB - The ever-increasing demand for high-bandwidth interconnects has given rise to the need for high IO-density package redistribution layers (RDL). This necessitates scaling down RDL critical dimensions as well as microvias. There are numerous challenges pertaining to scaling down microvias below 5 μm diameter. The main challenge is the thermomechanical reliability of vias in polymer dielectrics. Modeling and design for reliability in various polymer dielectrics is the key to achieve mechanical reliability. This paper presents a model for the prediction of micro-via failure. The effects of via geometry such as- via angle and height as well as material properties such as- CTE and elastic modulus on via failure are presented. Furthermore, modeling results are correlated with experimental results to verify the accuracy of the model. Using this model, it was determined that the conventional via geometry reaches an engineering limit at 2 μm of via diameter. Below this size, it becomes difficult to achieve reliable vias in polymers as they do not survive 1000 thermal cycles. Based on the modeling studies, a novel method is proposed for enhancement of reliability of vias below the engineering limit of 2 μm.
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U2 - 10.1109/ECTC32696.2021.00161
DO - 10.1109/ECTC32696.2021.00161
M3 - Conference contribution
AN - SCOPUS:85124656541
T3 - Proceedings - Electronic Components and Technology Conference
SP - 983
EP - 988
BT - Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 71st IEEE Electronic Components and Technology Conference, ECTC 2021
Y2 - 1 June 2021 through 4 July 2021
ER -