Reliability Modeling of Micro-vias in High-Density Redistribution Layers

Pratik Nimbalkar, Mohanalingam Kathaperumal, Fuhan Liu, Madhavan Swaminathan, Rao Tummala

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

The ever-increasing demand for high-bandwidth interconnects has given rise to the need for high IO-density package redistribution layers (RDL). This necessitates scaling down RDL critical dimensions as well as microvias. There are numerous challenges pertaining to scaling down microvias below 5 μm diameter. The main challenge is the thermomechanical reliability of vias in polymer dielectrics. Modeling and design for reliability in various polymer dielectrics is the key to achieve mechanical reliability. This paper presents a model for the prediction of micro-via failure. The effects of via geometry such as- via angle and height as well as material properties such as- CTE and elastic modulus on via failure are presented. Furthermore, modeling results are correlated with experimental results to verify the accuracy of the model. Using this model, it was determined that the conventional via geometry reaches an engineering limit at 2 μm of via diameter. Below this size, it becomes difficult to achieve reliable vias in polymers as they do not survive 1000 thermal cycles. Based on the modeling studies, a novel method is proposed for enhancement of reliability of vias below the engineering limit of 2 μm.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages983-988
Number of pages6
ISBN (Electronic)9780738145235
DOIs
StatePublished - 2021
Event71st IEEE Electronic Components and Technology Conference, ECTC 2021 - Virtual, Online, United States
Duration: Jun 1 2021Jul 4 2021

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2021-June
ISSN (Print)0569-5503

Conference

Conference71st IEEE Electronic Components and Technology Conference, ECTC 2021
Country/TerritoryUnited States
CityVirtual, Online
Period6/1/217/4/21

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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