Abstract
Switching noise manifests itself as peak noise and resonance noise in electronic packages. Numerous authors have discussed peak noise in the past with little emphasis associated with resonance noise. This paper provides results on the theoretical details and analysis for the simulation of resonance noise.
| Original language | English (US) |
|---|---|
| Pages | 169-172 |
| Number of pages | 4 |
| State | Published - 1995 |
| Event | Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, USA Duration: Oct 2 1995 → Oct 4 1995 |
Conference
| Conference | Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| City | Portland, OR, USA |
| Period | 10/2/95 → 10/4/95 |
All Science Journal Classification (ASJC) codes
- General Engineering
Fingerprint
Dive into the research topics of 'Resonance analysis and simulation in packages'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver