RF device integration on glass interposer toward 3D-IPAC packages

Yoichiro Sato, Bruce Chou, Vijay Sukumaran, Junki Min, Motoshi Ono, Choukri Karoui, Franck Dosseul, Christian Nopper, Madhavan Swaminathan, Venky Sundaram, Rao Tummala

Research output: Contribution to conferencePaperpeer-review

1 Scopus citations

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Engineering & Materials Science