RF substrates yield improvement using package-chip co-design and on-chip calibration

Abhilash Goyal, Madhavan Swaminathan, Abhijit Chatterjee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Fingerprint

Dive into the research topics of 'RF substrates yield improvement using package-chip co-design and on-chip calibration'. Together they form a unique fingerprint.

Engineering & Materials Science