Abstract
The possible role of the interconnect layout in plasma processing-induced damage is Investigated. Two sets of LDD n-MOSFETs with different metal 1 layouts are examined and compared to devices with larger metal gate antennae. The results clearly indicate that interconnect layouts may invoke MOSFET's degradation mechanisms different than the conventional plasma processing-induced capacitive charging of the gate oxide by gate antenna.
Original language | English (US) |
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Pages | 251-254 |
Number of pages | 4 |
DOIs | |
State | Published - 1997 |
Event | Proceedings of the 1997 2nd International Symposium on Plasma Process-Induced Damage - Monterey, CA, USA Duration: May 13 1997 → May 14 1997 |
Other
Other | Proceedings of the 1997 2nd International Symposium on Plasma Process-Induced Damage |
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City | Monterey, CA, USA |
Period | 5/13/97 → 5/14/97 |
All Science Journal Classification (ASJC) codes
- General Engineering