TY - GEN
T1 - RX equalization for a high-speed channel based on bayesian active learning using dropout
AU - Yang, Xianbo
AU - Tang, Junyan
AU - Torun, Hakki M.
AU - Becker, Wiren D.
AU - Hejase, Jose A.
AU - Swaminathan, Madhavan
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/10
Y1 - 2020/10
N2 - Determining optimal equalization settings in highspeed bus design simulations is becoming more important due to increased complexity and data rates of current server systems, but it is also time and resource consuming. In this paper, a probabilistic machine learning technique, Bayesian Active Learning using Dropout (BAL-DO), is utilized to perform RX equalization and optimization to address this issue. Largest HEYE opening and corresponding equalization settings are obtained with high prediction accuracy without performing extensive time-domain analysis, thereby significantly reducing the cost of engineering time and computational resources.
AB - Determining optimal equalization settings in highspeed bus design simulations is becoming more important due to increased complexity and data rates of current server systems, but it is also time and resource consuming. In this paper, a probabilistic machine learning technique, Bayesian Active Learning using Dropout (BAL-DO), is utilized to perform RX equalization and optimization to address this issue. Largest HEYE opening and corresponding equalization settings are obtained with high prediction accuracy without performing extensive time-domain analysis, thereby significantly reducing the cost of engineering time and computational resources.
UR - http://www.scopus.com/inward/record.url?scp=85096972338&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85096972338&partnerID=8YFLogxK
U2 - 10.1109/EPEPS48591.2020.9231471
DO - 10.1109/EPEPS48591.2020.9231471
M3 - Conference contribution
AN - SCOPUS:85096972338
T3 - EPEPS 2020 - IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems
BT - EPEPS 2020 - IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020
Y2 - 5 October 2020 through 7 October 2020
ER -