TY - GEN
T1 - Scalable driver I/O macromodels for statistical analysis
AU - Mutnury, Bhyrav
AU - Swaminathan, Madhavan
AU - Cases, Moises
AU - Pham, Nam
AU - De Araujo, Daniel N.
AU - Matoglu, Erdem
PY - 2005
Y1 - 2005
N2 - In this paper, scalable driver I/O macromodels have been proposed for efficient signal integrity and timing analysis of today's high-speed systems. Variations in semiconductor process, temperature, and power supply voltage affect the output voltage and current in driver circuits. The effect of these variations on driver and receiver circuits has been captured using Lagrange's interpolation technique. In this paper, scalable macromodeling approach has been applied to differential driver circuits and single-ended driver and receiver circuits. Scalable driver and receiver circuits consume less CPU memory and simulation time compared to transistor-level driver and receiver circuits. The accuracy of scalable macromodels has been tested on various test cases for differential driver and single-ended driver-receiver circuits and results yielded good accuracy.
AB - In this paper, scalable driver I/O macromodels have been proposed for efficient signal integrity and timing analysis of today's high-speed systems. Variations in semiconductor process, temperature, and power supply voltage affect the output voltage and current in driver circuits. The effect of these variations on driver and receiver circuits has been captured using Lagrange's interpolation technique. In this paper, scalable macromodeling approach has been applied to differential driver circuits and single-ended driver and receiver circuits. Scalable driver and receiver circuits consume less CPU memory and simulation time compared to transistor-level driver and receiver circuits. The accuracy of scalable macromodels has been tested on various test cases for differential driver and single-ended driver-receiver circuits and results yielded good accuracy.
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U2 - 10.1109/EPEP.2005.1563747
DO - 10.1109/EPEP.2005.1563747
M3 - Conference contribution
AN - SCOPUS:33845870905
SN - 0780392205
SN - 9780780392205
T3 - IEEE Topical Meeting on Electrical Performance of Electronic Packaging
SP - 239
EP - 242
BT - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
T2 - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Y2 - 24 October 2005 through 26 October 2005
ER -