Self-assembling MEMS variable and fixed RF inductors

V. M. Lubecke; B. Barber; E. Chan; D. Lopez; M. E. Gross; P. Gammel

doi:10.1109/22.963142

Self-assembling MEMS variable and fixed RF inductors

V. M. Lubecke, B. Barber, E. Chan, D. Lopez, M. E. Gross, P. Gammel

Electrical Engineering

Research output: Contribution to journal › Article › peer-review

118 Scopus citations

Abstract

Inductors play a key role in wireless front-end circuitry, yet are not generally well suited for conventional RF integrated-circuit (RFIC) fabrication processes. We have developed inductors that can be fabricated on a conventional RFIC silicon substrate, which use warping members to assemble themselves away from the substrate to improve quality factor (Q) and self-resonance frequency (SRF), and to provide a degree of variation in inductance value. These self-assembling variable inductors are realized through foundry provided microelectromechanical systems (MEMS) processing and have demonstrated temperature stable Q values greater than 13, SRF values well above 15 GHz, and inductance variations greater than 18%. Simulations suggest the potential for Q values above 20 and inductance variations greater than 30%, with optimized processing.

Original language	English (US)
Pages (from-to)	2093-2098
Number of pages	6
Journal	IEEE Transactions on Microwave Theory and Techniques
Volume	49
Issue number	11
DOIs	https://doi.org/10.1109/22.963142
State	Published - Nov 2001

All Science Journal Classification (ASJC) codes

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1109/22.963142

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abstract = "Inductors play a key role in wireless front-end circuitry, yet are not generally well suited for conventional RF integrated-circuit (RFIC) fabrication processes. We have developed inductors that can be fabricated on a conventional RFIC silicon substrate, which use warping members to assemble themselves away from the substrate to improve quality factor (Q) and self-resonance frequency (SRF), and to provide a degree of variation in inductance value. These self-assembling variable inductors are realized through foundry provided microelectromechanical systems (MEMS) processing and have demonstrated temperature stable Q values greater than 13, SRF values well above 15 GHz, and inductance variations greater than 18%. Simulations suggest the potential for Q values above 20 and inductance variations greater than 30%, with optimized processing.",

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AU - Lubecke, V. M.

AU - Barber, B.

AU - Chan, E.

AU - Lopez, D.

AU - Gross, M. E.

AU - Gammel, P.

PY - 2001/11

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AB - Inductors play a key role in wireless front-end circuitry, yet are not generally well suited for conventional RF integrated-circuit (RFIC) fabrication processes. We have developed inductors that can be fabricated on a conventional RFIC silicon substrate, which use warping members to assemble themselves away from the substrate to improve quality factor (Q) and self-resonance frequency (SRF), and to provide a degree of variation in inductance value. These self-assembling variable inductors are realized through foundry provided microelectromechanical systems (MEMS) processing and have demonstrated temperature stable Q values greater than 13, SRF values well above 15 GHz, and inductance variations greater than 18%. Simulations suggest the potential for Q values above 20 and inductance variations greater than 30%, with optimized processing.

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Self-assembling MEMS variable and fixed RF inductors

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