Self-Healing, Reconfigurable, Thermal-Switching, Transformative Electronics for Health Monitoring

Li Yang, Zihan Wang, Hao Wang, Biqiang Jin, Chuizhou Meng, Xue Chen, Runze Li, He Wang, Mingyang Xin, Zeshang Zhao, Shijie Guo, Jinrong Wu, Huanyu Cheng

Research output: Contribution to journalArticlepeer-review

29 Scopus citations

Abstract

Soft, deformable electronic devices provide the means to monitor physiological information and health conditions for disease diagnostics. However, their practical utility is limited due to the lack of intrinsical thermal switching for mechanically transformative adaptability and self-healing capability against mechanical damages. Here, the design concepts, materials and physics, manufacturing approaches, and application opportunities of self-healing, reconfigurable, thermal-switching device platforms based on hyperbranched polymers and biphasic liquid metal are reported. The former provides excellent self-healing performance and unique tunable stiffness and adhesion regulated by temperature for the on-skin switch, whereas the latter results in liquid metal circuits with extreme stretchability (>900%) and high conductivity (3.40 × 104 S cm−1), as well as simple recycling capability. Triggered by the increased temperature from the skin surface, a multifunctional device platform can conveniently conform and strongly adhere to the hierarchically textured skin surface for non-invasive, continuous, comfortable health monitoring. Additionally, the self-healing and adhesive characteristics allow multiple multifunctional circuit components to assemble and completely wrap on 3D curvilinear surfaces. Together, the design, manufacturing, and proof-of-concept demonstration of the self-healing, transformative, and self-assembled electronics open up new opportunities for robust soft deformable devices, smart robotics, prosthetics, and Internet-of-Things, and human–machine interfaces on irregular surfaces.

Original languageEnglish (US)
Article number2207742
JournalAdvanced Materials
Volume35
Issue number15
DOIs
StatePublished - Apr 13 2023

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Mechanics of Materials
  • Mechanical Engineering

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