Shallow hole drilling with ultrashort pulse lasers

B. R. Campbell; L. A. Forster; T. M. Lehecka; J. G. Thomas; V. V. Semak

doi:10.1117/12.760630

Shallow hole drilling with ultrashort pulse lasers

B. R. Campbell, L. A. Forster, T. M. Lehecka, J. G. Thomas, V. V. Semak

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Scopus citations

Abstract

Using a picosecond laser system that can operate at 1064, 532, 355, and 266nm wavelengths, experiments were conducted with polished metal samples to study material removal from a low number of laser pulse exposures. The samples were analyzed with a scanning electron microscope and white light interferometer to gather data on surface deformation and material removal. The effects of wavelength, energy and a double pulse exposure method were examined. Results were compared with simulations that model the material removal rates from ultrashort pulse drilling.

Original language	English (US)
Title of host publication	Photon Processing in Microelectronics and Photonics VII
DOIs	https://doi.org/10.1117/12.760630
State	Published - 2008
Event	Photon Processing in Microelectronics and Photonics VII - San Jose, CA, United States Duration: Jan 21 2008 → Jan 24 2008

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Volume	6879
ISSN (Print)	0277-786X

Other

Other	Photon Processing in Microelectronics and Photonics VII
Country/Territory	United States
City	San Jose, CA
Period	1/21/08 → 1/24/08

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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10.1117/12.760630

Cite this

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title = "Shallow hole drilling with ultrashort pulse lasers",

abstract = "Using a picosecond laser system that can operate at 1064, 532, 355, and 266nm wavelengths, experiments were conducted with polished metal samples to study material removal from a low number of laser pulse exposures. The samples were analyzed with a scanning electron microscope and white light interferometer to gather data on surface deformation and material removal. The effects of wavelength, energy and a double pulse exposure method were examined. Results were compared with simulations that model the material removal rates from ultrashort pulse drilling.",

author = "Campbell, {B. R.} and Forster, {L. A.} and Lehecka, {T. M.} and Thomas, {J. G.} and Semak, {V. V.}",

year = "2008",

doi = "10.1117/12.760630",

language = "English (US)",

isbn = "9780819470546",

series = "Proceedings of SPIE - The International Society for Optical Engineering",

booktitle = "Photon Processing in Microelectronics and Photonics VII",

note = "Photon Processing in Microelectronics and Photonics VII ; Conference date: 21-01-2008 Through 24-01-2008",

}

Campbell, BR, Forster, LA, Lehecka, TM, Thomas, JG & Semak, VV 2008, Shallow hole drilling with ultrashort pulse lasers. in Photon Processing in Microelectronics and Photonics VII., 68790J, Proceedings of SPIE - The International Society for Optical Engineering, vol. 6879, Photon Processing in Microelectronics and Photonics VII, San Jose, CA, United States, 1/21/08. https://doi.org/10.1117/12.760630

TY - GEN

T1 - Shallow hole drilling with ultrashort pulse lasers

AU - Campbell, B. R.

AU - Forster, L. A.

AU - Lehecka, T. M.

AU - Thomas, J. G.

AU - Semak, V. V.

PY - 2008

Y1 - 2008

N2 - Using a picosecond laser system that can operate at 1064, 532, 355, and 266nm wavelengths, experiments were conducted with polished metal samples to study material removal from a low number of laser pulse exposures. The samples were analyzed with a scanning electron microscope and white light interferometer to gather data on surface deformation and material removal. The effects of wavelength, energy and a double pulse exposure method were examined. Results were compared with simulations that model the material removal rates from ultrashort pulse drilling.

AB - Using a picosecond laser system that can operate at 1064, 532, 355, and 266nm wavelengths, experiments were conducted with polished metal samples to study material removal from a low number of laser pulse exposures. The samples were analyzed with a scanning electron microscope and white light interferometer to gather data on surface deformation and material removal. The effects of wavelength, energy and a double pulse exposure method were examined. Results were compared with simulations that model the material removal rates from ultrashort pulse drilling.

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U2 - 10.1117/12.760630

DO - 10.1117/12.760630

M3 - Conference contribution

AN - SCOPUS:44949108171

SN - 9780819470546

T3 - Proceedings of SPIE - The International Society for Optical Engineering

BT - Photon Processing in Microelectronics and Photonics VII

T2 - Photon Processing in Microelectronics and Photonics VII

Y2 - 21 January 2008 through 24 January 2008

ER -

Shallow hole drilling with ultrashort pulse lasers

Abstract

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All Science Journal Classification (ASJC) codes

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