@inproceedings{d8946c9c164f450c9a7ff23d95da20e9,
title = "Shallow hole drilling with ultrashort pulse lasers",
abstract = "Using a picosecond laser system that can operate at 1064, 532, 355, and 266nm wavelengths, experiments were conducted with polished metal samples to study material removal from a low number of laser pulse exposures. The samples were analyzed with a scanning electron microscope and white light interferometer to gather data on surface deformation and material removal. The effects of wavelength, energy and a double pulse exposure method were examined. Results were compared with simulations that model the material removal rates from ultrashort pulse drilling.",
author = "Campbell, {B. R.} and Forster, {L. A.} and Lehecka, {T. M.} and Thomas, {J. G.} and Semak, {V. V.}",
year = "2008",
doi = "10.1117/12.760630",
language = "English (US)",
isbn = "9780819470546",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
booktitle = "Photon Processing in Microelectronics and Photonics VII",
note = "Photon Processing in Microelectronics and Photonics VII ; Conference date: 21-01-2008 Through 24-01-2008",
}