Abstract
A new Pd/Pt/Au ohmic contact to p-InAs provides a lower specific contact resistance as deposited (9.6 × 10-7 Ω cm2) than Ti-based ohmic contacts prepared on the same epilayer (2.6 × 10-6 Ω cm2 or higher). The effect of the metal deposition method and annealing conditions on the resistance of the contacts is also reported.
Original language | English (US) |
---|---|
Pages (from-to) | 1866-1868 |
Number of pages | 3 |
Journal | Electronics Letters |
Volume | 39 |
Issue number | 25 |
DOIs | |
State | Published - Dec 11 2003 |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering