Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly

Andrew Carlson; Hyun Joon Kim-Lee; Jian Wu; Paulius Elvikis; Huanyu Cheng; Anton Kovalsky; Steven Elgan; Qingmin Yu; Placid M. Ferreira; Yonggang Huang; Kevin T. Turner; John A. Rogers

doi:10.1063/1.3605558

Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly

Andrew Carlson
, Hyun Joon Kim-Lee
, Jian Wu
, Paulius Elvikis
, Huanyu Cheng
, Anton Kovalsky
, Steven Elgan
, Qingmin Yu
, Placid M. Ferreira
, Yonggang Huang
, Kevin T. Turner
, John A. Rogers

Research output: Contribution to journal › Article › peer-review

158 Scopus citations

Abstract

This letter describes the physics and application of an approach to transfer printing that utilizes targeted shear loading to modulate stamp adhesion in a controlled and repeatable fashion. Experimental measurements of pull-off forces as functions of shear and stamp dimension reveal key scaling properties and provide a means for comparison to theory and modeling. Examples of printed structures in suspended and multilayer configurations demonstrate some capabilities in micro/nanoscale materials assembly.

Original language	English (US)
Article number	264104
Journal	Applied Physics Letters
Volume	98
Issue number	26
DOIs	https://doi.org/10.1063/1.3605558
State	Published - Jun 27 2011

All Science Journal Classification (ASJC) codes

Physics and Astronomy (miscellaneous)

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10.1063/1.3605558

Cite this

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title = "Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly",

abstract = "This letter describes the physics and application of an approach to transfer printing that utilizes targeted shear loading to modulate stamp adhesion in a controlled and repeatable fashion. Experimental measurements of pull-off forces as functions of shear and stamp dimension reveal key scaling properties and provide a means for comparison to theory and modeling. Examples of printed structures in suspended and multilayer configurations demonstrate some capabilities in micro/nanoscale materials assembly.",

author = "Andrew Carlson and Kim-Lee, \{Hyun Joon\} and Jian Wu and Paulius Elvikis and Huanyu Cheng and Anton Kovalsky and Steven Elgan and Qingmin Yu and Ferreira, \{Placid M.\} and Yonggang Huang and Turner, \{Kevin T.\} and Rogers, \{John A.\}",

note = "Funding Information: We thank T. Banks and B. Sankaran for assistance with processing using facilities at the Frederick Seitz Materials Research Laboratory (MRL). The general characterization facilities were provided through MRL with support from the University of Illinois and from DOE Grant Nos. DE-FG02-07ER46453 and DE-FG02-07ER46471. A.C. acknowledges support from the National Defense Science and Engineering Graduate (NDSEG) Fellowship program. K.T.T. and H.J.K. acknowledge support through AFOSR-MURI FA9550-08-1-0337 and NSF Grant No. CMMI-\#0845294. ",

year = "2011",

month = jun,

day = "27",

doi = "10.1063/1.3605558",

language = "English (US)",

volume = "98",

journal = "Applied Physics Letters",

issn = "0003-6951",

publisher = "American Institute of Physics",

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T1 - Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly

AU - Carlson, Andrew

AU - Kim-Lee, Hyun Joon

AU - Wu, Jian

AU - Elvikis, Paulius

AU - Cheng, Huanyu

AU - Kovalsky, Anton

AU - Elgan, Steven

AU - Yu, Qingmin

AU - Ferreira, Placid M.

AU - Huang, Yonggang

AU - Turner, Kevin T.

AU - Rogers, John A.

N1 - Funding Information: We thank T. Banks and B. Sankaran for assistance with processing using facilities at the Frederick Seitz Materials Research Laboratory (MRL). The general characterization facilities were provided through MRL with support from the University of Illinois and from DOE Grant Nos. DE-FG02-07ER46453 and DE-FG02-07ER46471. A.C. acknowledges support from the National Defense Science and Engineering Graduate (NDSEG) Fellowship program. K.T.T. and H.J.K. acknowledge support through AFOSR-MURI FA9550-08-1-0337 and NSF Grant No. CMMI-#0845294.

PY - 2011/6/27

Y1 - 2011/6/27

N2 - This letter describes the physics and application of an approach to transfer printing that utilizes targeted shear loading to modulate stamp adhesion in a controlled and repeatable fashion. Experimental measurements of pull-off forces as functions of shear and stamp dimension reveal key scaling properties and provide a means for comparison to theory and modeling. Examples of printed structures in suspended and multilayer configurations demonstrate some capabilities in micro/nanoscale materials assembly.

AB - This letter describes the physics and application of an approach to transfer printing that utilizes targeted shear loading to modulate stamp adhesion in a controlled and repeatable fashion. Experimental measurements of pull-off forces as functions of shear and stamp dimension reveal key scaling properties and provide a means for comparison to theory and modeling. Examples of printed structures in suspended and multilayer configurations demonstrate some capabilities in micro/nanoscale materials assembly.

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UR - https://www.scopus.com/pages/publications/79960080973#tab=citedBy

U2 - 10.1063/1.3605558

DO - 10.1063/1.3605558

M3 - Article

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SN - 0003-6951

VL - 98

JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 26

M1 - 264104

ER -

Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly

Abstract

All Science Journal Classification (ASJC) codes

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