Signal and power integrity co-simulation for multi-layered system on package modules

The coupling of simultaneous switching noise (SSM) in mixed signal system on package modules is a critical signal and power integrity (SI/PI) problem. In the presence of split planes and apertures, SSN coupling occurs both horizontally as well as vertically across layers. Thus, to catch SI and PI problems at an early stage of design requires fast signal and power co-simulation methodologies. In this paper, we outline the multi-layer finite difference method and how the accuracy of the technique can be enhanced with models for fringe and gap effects. We then briefly describe a method for integrating the signal distribution network with the power distribution network to enable co-simulation. The method is then applied to a mixed signal board containing split planes, and numerical results are compared to full-wave simulations.