Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration

Jinwoo Kim, Venkata Chaitanya Krishna Chekuri, Nael Mizanur Rahman, Majid Ahadi Dolatsara, Hakki Torun, Madhavan Swaminathan, Saibal Mukhopadhyay, Sung Kyu Lim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations


The optimal selection of an interposer substrate is important in 2.5D systems, because its physical, material and electrical characteristics govern the overall system performance, reliability and cost. Several materials have been proposed that offer various tradeoffs including silicon, organic, glass and etc. In this paper, we conduct a quantitative comparison between two 2.5D IC designs based on silicon vs. liquid crystal polymer (LCP) interposer technologies in the overall system level for the first time. We also investigate tradeoffs in power, performance and area (PPA), signal integrity (SI) and power integrity (PI) depending on the interposer technologies. Through our flow, we generate a large-scale benchmark architecture with commercial-grade GDS layouts of interposer and chiplets using two different interposer substrates. Then, we model transmission lines and power delivery network (PDN) of each 2.5D IC design. Finally, we perform PPA analysis, SI and PI on both 2.5D IC designs to observe the quantitative tradeoffs between two designs. Our experiment shows that silicon interposer-based design has 10.46% less power, 0.25× smaller area and 0.57× shorter average wirelength compared to LCP interposer-based design. However, LCP-based design has 0.59× smaller PDN DC impedance and 0.75× shorter worst delay of interposer wire while maintaining the power delivery efficiency. Lastly, our cost analysis of 2.5D IC design indicates that the overall cost of organic LCP technology, if both the chiplets and their interposer costs are combined, is 2.69× higher than the silicon even the cost of LCP interposer is 1.91% of silicon interposer. This indicates that LCP technology is prohibitive unless the interconnect and bump dimensions are dramatically reduced.

Original languageEnglish (US)
Title of host publicationProceedings - 2020 IEEE 38th International Conference on Computer Design, ICCD 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages8
ISBN (Electronic)9781728197104
StatePublished - Oct 2020
Event38th IEEE International Conference on Computer Design, ICCD 2020 - Hartford, United States
Duration: Oct 18 2020Oct 21 2020

Publication series

NameProceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors
ISSN (Print)1063-6404


Conference38th IEEE International Conference on Computer Design, ICCD 2020
Country/TerritoryUnited States

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering


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