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Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration
Jinwoo Kim, Venkata Chaitanya Krishna Chekuri, Nael Mizanur Rahman, Majid Ahadi Dolatsara, Hakki Torun, Madhavan Swaminathan, Saibal Mukhopadhyay, Sung Kyu Lim
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
18
Scopus
citations