Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration

Jinwoo Kim, Venkata Chaitanya Krishna Chekuri, Nael Mizanur Rahman, Majid Ahadi Dolatsara, Hakki Torun, Madhavan Swaminathan, Saibal Mukhopadhyay, Sung Kyu Lim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

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Engineering & Materials Science