Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration
- Jinwoo Kim
- , Venkata Chaitanya Krishna Chekuri
- , Nael Mizanur Rahman
- , Majid Ahadi Dolatsara
- , Hakki Torun
- , Madhavan Swaminathan
- , Saibal Mukhopadhyay
- , Sung Kyu Lim
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
27
Link opens in a new tab
Scopus
citations