Abstract
This paper discusses the use of the Generalized Transmission Line Equations (GTLE) for the simulation of switching noise distribution in multi-layered packaging structures. After a brief discussion on the formulation and its application to a simple dual trace transmission line, two-layered plane and two-layered plane with four drivers and traces, the method has been applied to a complicated fourteen-layer structure which consists of the package and board power distribution. This structure includes non-ideal decoupling capacitors placed on the package/board, vias connecting the planes, drivers and traces. This paper demonstrates the advantage of the GTLE method over SPICE in terms of efficiency and accuracy. In addition, this paper provides insight into the noise mechanism arising in multi-layered power distribution networks.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 1026-1031 |
| Number of pages | 6 |
| Journal | IEEE International Symposium on Electromagnetic Compatibility |
| Volume | 2 |
| State | Published - 2002 |
| Event | 2002 IEEE International Symposium on Electromagnetic Compatibility - Minneapolis, MN, United States Duration: Aug 19 2002 → Aug 23 2002 |
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Electrical and Electronic Engineering