Simulation of switching noise in on-chip power distribution networks of FPGAs

Subramanian N. Lalgudi; Yaron Ketchmer; Madhavan Swaminathan

doi:10.1109/EPEP.2005.1563769

Simulation of switching noise in on-chip power distribution networks of FPGAs

Subramanian N. Lalgudi, Yaron Ketchmer, Madhavan Swaminathan

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Scopus citations

Abstract

An explicit approach has been used to simulate switching noise in on-chip power distribution networks. This approach has been extended to analyze on-chip power distribution networks of Field Programmable Gate Array (FPGA),whosepowerdistributionnetwork is more irregular than that of an Application Specific Integrated Circuit (ASIC). The switching noise has been compared between the on-chip power distribution networks of FPGAs and ASICs. Switching noise simulation of power/ground grids requires a static IR drop analysis before the transient simulation. The importance of performing a static IR drop analysis prior to the transient simulation has been illustrated.

Original language	English (US)
Title of host publication	14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Pages	319-322
Number of pages	4
DOIs	https://doi.org/10.1109/EPEP.2005.1563769
State	Published - 2005
Event	14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 - Austin, TX, United States Duration: Oct 24 2005 → Oct 26 2005

Publication series

Name	IEEE Topical Meeting on Electrical Performance of Electronic Packaging
Volume	2005

Conference

Conference	14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Country/Territory	United States
City	Austin, TX
Period	10/24/05 → 10/26/05

All Science Journal Classification (ASJC) codes

General Engineering

Access to Document

10.1109/EPEP.2005.1563769

Cite this

Lalgudi, S. N., Ketchmer, Y., & Swaminathan, M. (2005). Simulation of switching noise in on-chip power distribution networks of FPGAs. In 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 (pp. 319-322). Article 1563769 (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; Vol. 2005). https://doi.org/10.1109/EPEP.2005.1563769

@inproceedings{95a9dd6273d04e6b87ba3af44633be57,

title = "Simulation of switching noise in on-chip power distribution networks of FPGAs",

abstract = "An explicit approach has been used to simulate switching noise in on-chip power distribution networks. This approach has been extended to analyze on-chip power distribution networks of Field Programmable Gate Array (FPGA),whosepowerdistributionnetwork is more irregular than that of an Application Specific Integrated Circuit (ASIC). The switching noise has been compared between the on-chip power distribution networks of FPGAs and ASICs. Switching noise simulation of power/ground grids requires a static IR drop analysis before the transient simulation. The importance of performing a static IR drop analysis prior to the transient simulation has been illustrated.",

author = "Lalgudi, {Subramanian N.} and Yaron Ketchmer and Madhavan Swaminathan",

year = "2005",

doi = "10.1109/EPEP.2005.1563769",

language = "English (US)",

isbn = "0780392205",

series = "IEEE Topical Meeting on Electrical Performance of Electronic Packaging",

pages = "319--322",

booktitle = "14th Topical Meeting on Electrical Performance of Electronic Packaging 2005",

note = "14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 ; Conference date: 24-10-2005 Through 26-10-2005",

}

Lalgudi, SN, Ketchmer, Y & Swaminathan, M 2005, Simulation of switching noise in on-chip power distribution networks of FPGAs. in 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005., 1563769, IEEE Topical Meeting on Electrical Performance of Electronic Packaging, vol. 2005, pp. 319-322, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, Austin, TX, United States, 10/24/05. https://doi.org/10.1109/EPEP.2005.1563769

Simulation of switching noise in on-chip power distribution networks of FPGAs. / Lalgudi, Subramanian N.; Ketchmer, Yaron; Swaminathan, Madhavan.
14th Topical Meeting on Electrical Performance of Electronic Packaging 2005. 2005. p. 319-322 1563769 (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; Vol. 2005).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Simulation of switching noise in on-chip power distribution networks of FPGAs

AU - Lalgudi, Subramanian N.

AU - Ketchmer, Yaron

AU - Swaminathan, Madhavan

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N2 - An explicit approach has been used to simulate switching noise in on-chip power distribution networks. This approach has been extended to analyze on-chip power distribution networks of Field Programmable Gate Array (FPGA),whosepowerdistributionnetwork is more irregular than that of an Application Specific Integrated Circuit (ASIC). The switching noise has been compared between the on-chip power distribution networks of FPGAs and ASICs. Switching noise simulation of power/ground grids requires a static IR drop analysis before the transient simulation. The importance of performing a static IR drop analysis prior to the transient simulation has been illustrated.

AB - An explicit approach has been used to simulate switching noise in on-chip power distribution networks. This approach has been extended to analyze on-chip power distribution networks of Field Programmable Gate Array (FPGA),whosepowerdistributionnetwork is more irregular than that of an Application Specific Integrated Circuit (ASIC). The switching noise has been compared between the on-chip power distribution networks of FPGAs and ASICs. Switching noise simulation of power/ground grids requires a static IR drop analysis before the transient simulation. The importance of performing a static IR drop analysis prior to the transient simulation has been illustrated.

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SN - 9780780392205

T3 - IEEE Topical Meeting on Electrical Performance of Electronic Packaging

SP - 319

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BT - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005

T2 - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005

Y2 - 24 October 2005 through 26 October 2005

ER -

Simulation of switching noise in on-chip power distribution networks of FPGAs

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