As part of the System on a Package (SOP) concept being developed at the Packaging Research Center (PRC), Georgia Tech, a test vehicle to demonstrate the suppression of simultaneous switching noise (SSN) using embedded decoupling capacitors is being implemented. This test vehicle uses thin film sequential buildup technology on a low-cost organic platform incorporating polymer-ceramic nanocomposite dielectrics. This paper presents the design, fabrication and validation of embedded decoupling for SOP technology.
|Original language||English (US)|
|Number of pages||5|
|Journal||Proceedings - Electronic Components and Technology Conference|
|State||Published - 2001|
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering