Simultaneous switching noise suppression for high speed systems using embedded decoupling

Joseph M. Hobbs; Hitesh Windlass; Venky Sundaram; Sungjun Chun; George E. White; Madhavan Swaminathan; Rao R. Tummala

doi:10.1109/ECTC.2001.927746

Simultaneous switching noise suppression for high speed systems using embedded decoupling

Joseph M. Hobbs, Hitesh Windlass, Venky Sundaram, Sungjun Chun, George E. White, Madhavan Swaminathan, Rao R. Tummala

Electrical Engineering

Research output: Contribution to journal › Article › peer-review

41 Scopus citations

Abstract

As part of the System on a Package (SOP) concept being developed at the Packaging Research Center (PRC), Georgia Tech, a test vehicle to demonstrate the suppression of simultaneous switching noise (SSN) using embedded decoupling capacitors is being implemented. This test vehicle uses thin film sequential buildup technology on a low-cost organic platform incorporating polymer-ceramic nanocomposite dielectrics. This paper presents the design, fabrication and validation of embedded decoupling for SOP technology.

Original language	English (US)
Pages (from-to)	339-343
Number of pages	5
Journal	Proceedings - Electronic Components and Technology Conference
DOIs	https://doi.org/10.1109/ECTC.2001.927746
State	Published - 2001

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2001.927746

Cite this

@article{808b0902373e458b88a814e2d6d99ccf,

title = "Simultaneous switching noise suppression for high speed systems using embedded decoupling",

abstract = "As part of the System on a Package (SOP) concept being developed at the Packaging Research Center (PRC), Georgia Tech, a test vehicle to demonstrate the suppression of simultaneous switching noise (SSN) using embedded decoupling capacitors is being implemented. This test vehicle uses thin film sequential buildup technology on a low-cost organic platform incorporating polymer-ceramic nanocomposite dielectrics. This paper presents the design, fabrication and validation of embedded decoupling for SOP technology.",

author = "Hobbs, {Joseph M.} and Hitesh Windlass and Venky Sundaram and Sungjun Chun and White, {George E.} and Madhavan Swaminathan and Tummala, {Rao R.}",

year = "2001",

doi = "10.1109/ECTC.2001.927746",

language = "English (US)",

pages = "339--343",

journal = "Proceedings - Electronic Components and Technology Conference",

issn = "0569-5503",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - JOUR

T1 - Simultaneous switching noise suppression for high speed systems using embedded decoupling

AU - Hobbs, Joseph M.

AU - Windlass, Hitesh

AU - Sundaram, Venky

AU - Chun, Sungjun

AU - White, George E.

AU - Swaminathan, Madhavan

AU - Tummala, Rao R.

PY - 2001

Y1 - 2001

N2 - As part of the System on a Package (SOP) concept being developed at the Packaging Research Center (PRC), Georgia Tech, a test vehicle to demonstrate the suppression of simultaneous switching noise (SSN) using embedded decoupling capacitors is being implemented. This test vehicle uses thin film sequential buildup technology on a low-cost organic platform incorporating polymer-ceramic nanocomposite dielectrics. This paper presents the design, fabrication and validation of embedded decoupling for SOP technology.

AB - As part of the System on a Package (SOP) concept being developed at the Packaging Research Center (PRC), Georgia Tech, a test vehicle to demonstrate the suppression of simultaneous switching noise (SSN) using embedded decoupling capacitors is being implemented. This test vehicle uses thin film sequential buildup technology on a low-cost organic platform incorporating polymer-ceramic nanocomposite dielectrics. This paper presents the design, fabrication and validation of embedded decoupling for SOP technology.

UR - http://www.scopus.com/inward/record.url?scp=0034835719&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0034835719&partnerID=8YFLogxK

U2 - 10.1109/ECTC.2001.927746

DO - 10.1109/ECTC.2001.927746

M3 - Article

AN - SCOPUS:0034835719

SN - 0569-5503

SP - 339

EP - 343

JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

ER -

Simultaneous switching noise suppression for high speed systems using embedded decoupling

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this