Simultaneous switching noise suppression for high speed systems using embedded decoupling

Joseph M. Hobbs, Hitesh Windlass, Venky Sundaram, Sungjun Chun, George E. White, Madhavan Swaminathan, Rao R. Tummala

Research output: Contribution to journalArticlepeer-review

41 Scopus citations


As part of the System on a Package (SOP) concept being developed at the Packaging Research Center (PRC), Georgia Tech, a test vehicle to demonstrate the suppression of simultaneous switching noise (SSN) using embedded decoupling capacitors is being implemented. This test vehicle uses thin film sequential buildup technology on a low-cost organic platform incorporating polymer-ceramic nanocomposite dielectrics. This paper presents the design, fabrication and validation of embedded decoupling for SOP technology.

Original languageEnglish (US)
Pages (from-to)339-343
Number of pages5
JournalProceedings - Electronic Components and Technology Conference
StatePublished - 2001

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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