Simultaneous switching noise suppression for high speed systems using embedded decoupling

Joseph M. Hobbs; Hitesh Windlass; Venky Sundaram; Sungjun Chun; George E. White; Madhavan Swaminathan; Rao R. Tummala

doi:10.1109/ECTC.2001.927746

Simultaneous switching noise suppression for high speed systems using embedded decoupling

Joseph M. Hobbs, Hitesh Windlass, Venky Sundaram, Sungjun Chun, George E. White, Madhavan Swaminathan, Rao R. Tummala

Electrical Engineering

Research output: Contribution to journal › Article › peer-review

41 Scopus citations

Abstract

As part of the System on a Package (SOP) concept being developed at the Packaging Research Center (PRC), Georgia Tech, a test vehicle to demonstrate the suppression of simultaneous switching noise (SSN) using embedded decoupling capacitors is being implemented. This test vehicle uses thin film sequential buildup technology on a low-cost organic platform incorporating polymer-ceramic nanocomposite dielectrics. This paper presents the design, fabrication and validation of embedded decoupling for SOP technology.

Original language	English (US)
Pages (from-to)	339-343
Number of pages	5
Journal	Proceedings - Electronic Components and Technology Conference
DOIs	https://doi.org/10.1109/ECTC.2001.927746
State	Published - 2001

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/ECTC.2001.927746

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abstract = "As part of the System on a Package (SOP) concept being developed at the Packaging Research Center (PRC), Georgia Tech, a test vehicle to demonstrate the suppression of simultaneous switching noise (SSN) using embedded decoupling capacitors is being implemented. This test vehicle uses thin film sequential buildup technology on a low-cost organic platform incorporating polymer-ceramic nanocomposite dielectrics. This paper presents the design, fabrication and validation of embedded decoupling for SOP technology.",

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AU - Hobbs, Joseph M.

AU - Windlass, Hitesh

AU - Sundaram, Venky

AU - Chun, Sungjun

AU - White, George E.

AU - Swaminathan, Madhavan

AU - Tummala, Rao R.

PY - 2001

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AB - As part of the System on a Package (SOP) concept being developed at the Packaging Research Center (PRC), Georgia Tech, a test vehicle to demonstrate the suppression of simultaneous switching noise (SSN) using embedded decoupling capacitors is being implemented. This test vehicle uses thin film sequential buildup technology on a low-cost organic platform incorporating polymer-ceramic nanocomposite dielectrics. This paper presents the design, fabrication and validation of embedded decoupling for SOP technology.

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JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

ER -

Simultaneous switching noise suppression for high speed systems using embedded decoupling

Abstract

All Science Journal Classification (ASJC) codes

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