Simultaneous switching noise suppression for high speed systems using embedded decoupling

Joseph M. Hobbs; Hitesh Windlass; Venky Sundaram; Sungjun Chun; George E. White; Madhavan Swaminathan; Rao R. Tummala

doi:10.1109/ECTC.2001.927746

Simultaneous switching noise suppression for high speed systems using embedded decoupling

Joseph M. Hobbs
, Hitesh Windlass
, Venky Sundaram
, Sungjun Chun
, George E. White
, Madhavan Swaminathan
, Rao R. Tummala

Electrical Engineering

Research output: Contribution to journal › Article › peer-review

41 Scopus citations

Abstract

As part of the System on a Package (SOP) concept being developed at the Packaging Research Center (PRC), Georgia Tech, a test vehicle to demonstrate the suppression of simultaneous switching noise (SSN) using embedded decoupling capacitors is being implemented. This test vehicle uses thin film sequential buildup technology on a low-cost organic platform incorporating polymer-ceramic nanocomposite dielectrics. This paper presents the design, fabrication and validation of embedded decoupling for SOP technology.

Original language	English (US)
Pages (from-to)	339-343
Number of pages	5
Journal	Proceedings - Electronic Components and Technology Conference
DOIs	https://doi.org/10.1109/ECTC.2001.927746
State	Published - 2001

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/ECTC.2001.927746

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abstract = "As part of the System on a Package (SOP) concept being developed at the Packaging Research Center (PRC), Georgia Tech, a test vehicle to demonstrate the suppression of simultaneous switching noise (SSN) using embedded decoupling capacitors is being implemented. This test vehicle uses thin film sequential buildup technology on a low-cost organic platform incorporating polymer-ceramic nanocomposite dielectrics. This paper presents the design, fabrication and validation of embedded decoupling for SOP technology.",

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journal = "Proceedings - Electronic Components and Technology Conference",

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AU - Hobbs, Joseph M.

AU - Windlass, Hitesh

AU - Sundaram, Venky

AU - Chun, Sungjun

AU - White, George E.

AU - Swaminathan, Madhavan

AU - Tummala, Rao R.

PY - 2001

Y1 - 2001

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AB - As part of the System on a Package (SOP) concept being developed at the Packaging Research Center (PRC), Georgia Tech, a test vehicle to demonstrate the suppression of simultaneous switching noise (SSN) using embedded decoupling capacitors is being implemented. This test vehicle uses thin film sequential buildup technology on a low-cost organic platform incorporating polymer-ceramic nanocomposite dielectrics. This paper presents the design, fabrication and validation of embedded decoupling for SOP technology.

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JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

ER -

Simultaneous switching noise suppression for high speed systems using embedded decoupling

Abstract

All Science Journal Classification (ASJC) codes

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