Skin effect modeling of interconnects using the Laguerre-FDTD scheme

Ming Yi; Madhavan Swaminathan; Zhiguo Qian; Alaeddin Aydiner

doi:10.1109/EPEPS.2012.6457885

Skin effect modeling of interconnects using the Laguerre-FDTD scheme

Ming Yi, Madhavan Swaminathan, Zhiguo Qian, Alaeddin Aydiner

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Scopus citations

Abstract

The Laguerre-FDTD scheme is unconditionally stable for transient electromagnetic simulation and is ideally suited for modeling multi-scale structures such as packaging and interconnects. In this work, skin effect is incorporated into Laguerre-FDTD to ensure fast simulation speed and high accuracy with less dense mesh applied. The skin effect is modeled by applying the surface impedance boundary condition (SIBC) on the interface of conductor and dielectric material. A method of transferring the time domain convolution term in SIBC formulation into Laguerre domain is proposed. Results from microstrip and TSV structures have been presented which show good calculation accuracy and efficiency of the SIBC incorporated Laguerre-FDTD method.

Original language	English (US)
Title of host publication	2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
Pages	236-239
Number of pages	4
DOIs	https://doi.org/10.1109/EPEPS.2012.6457885
State	Published - 2012
Event	2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 - Tempe, AZ, United States Duration: Oct 21 2012 → Oct 24 2012

Publication series

Name	2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012

Conference

Conference	2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
Country/Territory	United States
City	Tempe, AZ
Period	10/21/12 → 10/24/12

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Access to Document

10.1109/EPEPS.2012.6457885

Cite this

Yi, M., Swaminathan, M., Qian, Z., & Aydiner, A. (2012). Skin effect modeling of interconnects using the Laguerre-FDTD scheme. In 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 (pp. 236-239). Article 6457885 (2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012). https://doi.org/10.1109/EPEPS.2012.6457885

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title = "Skin effect modeling of interconnects using the Laguerre-FDTD scheme",

abstract = "The Laguerre-FDTD scheme is unconditionally stable for transient electromagnetic simulation and is ideally suited for modeling multi-scale structures such as packaging and interconnects. In this work, skin effect is incorporated into Laguerre-FDTD to ensure fast simulation speed and high accuracy with less dense mesh applied. The skin effect is modeled by applying the surface impedance boundary condition (SIBC) on the interface of conductor and dielectric material. A method of transferring the time domain convolution term in SIBC formulation into Laguerre domain is proposed. Results from microstrip and TSV structures have been presented which show good calculation accuracy and efficiency of the SIBC incorporated Laguerre-FDTD method.",

author = "Ming Yi and Madhavan Swaminathan and Zhiguo Qian and Alaeddin Aydiner",

year = "2012",

doi = "10.1109/EPEPS.2012.6457885",

language = "English (US)",

isbn = "9781467325394",

series = "2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012",

pages = "236--239",

booktitle = "2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012",

note = "2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 ; Conference date: 21-10-2012 Through 24-10-2012",

}

Yi, M, Swaminathan, M, Qian, Z & Aydiner, A 2012, Skin effect modeling of interconnects using the Laguerre-FDTD scheme. in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012., 6457885, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012, pp. 236-239, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012, Tempe, AZ, United States, 10/21/12. https://doi.org/10.1109/EPEPS.2012.6457885

Skin effect modeling of interconnects using the Laguerre-FDTD scheme. / Yi, Ming; Swaminathan, Madhavan; Qian, Zhiguo et al.
2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012. 2012. p. 236-239 6457885 (2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - The Laguerre-FDTD scheme is unconditionally stable for transient electromagnetic simulation and is ideally suited for modeling multi-scale structures such as packaging and interconnects. In this work, skin effect is incorporated into Laguerre-FDTD to ensure fast simulation speed and high accuracy with less dense mesh applied. The skin effect is modeled by applying the surface impedance boundary condition (SIBC) on the interface of conductor and dielectric material. A method of transferring the time domain convolution term in SIBC formulation into Laguerre domain is proposed. Results from microstrip and TSV structures have been presented which show good calculation accuracy and efficiency of the SIBC incorporated Laguerre-FDTD method.

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Yi M, Swaminathan M, Qian Z, Aydiner A. Skin effect modeling of interconnects using the Laguerre-FDTD scheme. In 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012. 2012. p. 236-239. 6457885. (2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012). doi: 10.1109/EPEPS.2012.6457885

Skin effect modeling of interconnects using the Laguerre-FDTD scheme

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