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Smaller Microvias for Packaging Interconnects by Picosecond UV Laser with a Nanometer Metal Barrier Layer: A Feasibility Study
Fuhan Liu, Rui Zhang, Gaurav Khurana, Bartlet H. Deprospo, Rao R. Tummala, Madhavan Swaminathan
Research output: Contribution to journal › Article › peer-review
13
Scopus
citations