Smaller Microvias for Packaging Interconnects by Picosecond UV Laser with a Nanometer Metal Barrier Layer: A Feasibility Study
- Fuhan Liu
- , Rui Zhang
- , Gaurav Khurana
- , Bartlet H. Deprospo
- , Rao R. Tummala
- , Madhavan Swaminathan
Research output: Contribution to journal › Article › peer-review
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