Soft Microreactors for the Deposition of Conductive Metallic Traces on Planar, Embossed, and Curved Surfaces

Keyphrases

• Circuitry 100%
• Electronic Components 100%
• Curved Surface 100%
• Planar Surfaces 100%
• Microreactor 100%
• Patterned Deposition 100%
• Two Dimensional 50%
• Low Temperature 50%
• Unique Design 50%
• Antenna 50%
• Metallization 50%
• Computing Systems 50%
• Inorganic Materials 50%
• Bloating 50%
• Freeform 50%
• Design Opportunities 50%
• Consumer Products 50%
• Solution Phase 50%
• Manufacturing Methods 50%
• Non-planar 50%
• Support Elements 50%
• Reconfigurable 50%
• Polymeric Component 50%
• Large-scale Production 50%
• Advanced Manufacturing 50%
• Efficient Production 50%
• Simple Circuit 50%
• Non-native Substrate 50%
• Electroless Copper Deposition 50%
• Manufacturing Strategy 50%
• Economical Production 50%
• Two-dimensional Substrate 50%
• Non-planar Devices 50%
• Processing Opportunity 50%

Engineering

• Conductive 100%
• Microreactor 100%
• Two Dimensional 66%
• Low-Temperature 33%
• Antenna 33%
• Integral Part 33%
• Design Opportunity 33%
• Consumer Product 33%
• Interconnects 33%
• Lithography 33%
• Metallizations 33%
• Advanced Manufacturing 33%
• Simple Circuit 33%
• Planar Surface 33%
• Approach Phase 33%
• Manufacturing Strategy 33%

Material Science

• Electronic Component 100%
• Electronic Circuit 50%
• Lithography 50%