Solder bonding for microelectromechanical systems (MEMS) applications

Abhijat Goyal, Srinivas Tadigadapa, Rafiqul Islam

Research output: Contribution to journalConference articlepeer-review

9 Scopus citations


MEMS fabrication and packaging requires a bonding technology that is universal for all substrates, has high resolution, requires relatively lower temperatures, is reliable and is low cost to implement. The bonding technology presented meets the above standards. The process is substrate independent and involves aligned bonding of two similarly patterned wafers using tin solder as the bonding material. The technique can be used for whole wafer or selected area bonding. The resolution of this technique is only limited by the resolution that can be achieved in the patterning and delineation of the seed metal.

Original languageEnglish (US)
Pages (from-to)281-288
Number of pages8
JournalProceedings of SPIE - The International Society for Optical Engineering
StatePublished - 2003
EventReliability, Testing, and Characterization of MEMS/MOEMS II - San Jose, CA, United States
Duration: Jan 27 2003Jan 29 2003

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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