Abstract
MEMS fabrication and packaging requires a bonding technology that is universal for all substrates, has high resolution, requires relatively lower temperatures, is reliable and is low cost to implement. The bonding technology presented meets the above standards. The process is substrate independent and involves aligned bonding of two similarly patterned wafers using tin solder as the bonding material. The technique can be used for whole wafer or selected area bonding. The resolution of this technique is only limited by the resolution that can be achieved in the patterning and delineation of the seed metal.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 281-288 |
| Number of pages | 8 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 4980 |
| DOIs | |
| State | Published - 2003 |
| Event | Reliability, Testing, and Characterization of MEMS/MOEMS II - San Jose, CA, United States Duration: Jan 27 2003 → Jan 29 2003 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering