Special issue on InterPACK 2019 – Part 1

  • Sreekant Narumanchi
  • , Sukwon Choi
  • , Saket Karajgikar
  • , Haiding Sun
  • , Guangsheng Zhang

Research output: Contribution to journalEditorialpeer-review

Original languageEnglish (US)
Article number030301
JournalJournal of Electronic Packaging
Volume142
Issue number3
StatePublished - Sep 2020

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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