Special Issue on InterPACK2020

Research output: Contribution to journal › Editorial › peer-review

Original language	English (US)
Article number	020301
Journal	Journal of Electronic Packaging
Volume	144
Issue number	2
State	Published - Jun 2022

All Science Journal Classification (ASJC) codes

@article{f472c8cd0c4c49698f966a8acf408fb5,

title = "Special Issue on InterPACK2020",

author = "Jin Yang and Sukwon Choi and Jaeho Lee and Saket Karajgikar",

year = "2022",

month = jun,

language = "English (US)",

volume = "144",

journal = "Journal of Electronic Packaging",

issn = "1043-7398",

publisher = "American Society of Mechanical Engineers (ASME)",

number = "2",

}

TY - JOUR

T1 - Special Issue on InterPACK2020

AU - Yang, Jin

AU - Choi, Sukwon

AU - Lee, Jaeho

AU - Karajgikar, Saket

PY - 2022/6

Y1 - 2022/6

UR - https://www.scopus.com/pages/publications/85127404192

UR - https://www.scopus.com/pages/publications/85127404192#tab=citedBy

M3 - Editorial

AN - SCOPUS:85127404192

SN - 1043-7398

VL - 144

JO - Journal of Electronic Packaging

JF - Journal of Electronic Packaging

IS - 2

M1 - 020301

ER -