Special Issue on InterPACK2022

Jin Yang; Sukwon Choi; Benjamin Leever; Cheng Chen

doi:10.1115/1.4063893

Special Issue on InterPACK2022

Jin Yang
, Sukwon Choi
, Benjamin Leever
, Cheng Chen

Mechanical Engineering

Research output: Contribution to journal › Editorial › peer-review

Original language	English (US)
Article number	4063893
Journal	Journal of Electronic Packaging
Volume	145
Issue number	4
DOIs	https://doi.org/10.1115/1.4063893
State	Published - Dec 1 2023

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Mechanics of Materials
Computer Science Applications
Electrical and Electronic Engineering

Access to Document

10.1115/1.4063893

Cite this

@article{1d5ff03ab9794024a18dfbbf046cbf85,

title = "Special Issue on InterPACK2022",

author = "Jin Yang and Sukwon Choi and Benjamin Leever and Cheng Chen",

year = "2023",

month = dec,

day = "1",

doi = "10.1115/1.4063893",

language = "English (US)",

volume = "145",

journal = "Journal of Electronic Packaging",

issn = "1043-7398",

publisher = "American Society of Mechanical Engineers (ASME)",

number = "4",

}

TY - JOUR

T1 - Special Issue on InterPACK2022

AU - Yang, Jin

AU - Choi, Sukwon

AU - Leever, Benjamin

AU - Chen, Cheng

PY - 2023/12/1

Y1 - 2023/12/1

UR - https://www.scopus.com/pages/publications/85207156245

UR - https://www.scopus.com/pages/publications/85207156245#tab=citedBy

U2 - 10.1115/1.4063893

DO - 10.1115/1.4063893

M3 - Editorial

AN - SCOPUS:85207156245

SN - 1043-7398

VL - 145

JO - Journal of Electronic Packaging

JF - Journal of Electronic Packaging

IS - 4

M1 - 4063893

ER -

Special Issue on InterPACK2022

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Cite this