Special Section on InterPACK2021

Jin Yang; Przemyslaw Gromala; Sukwon Choi; Damena Agonafer; Patrick Mccluskey

doi:10.1115/1.4056558

Special Section on InterPACK2021

Jin Yang
, Przemyslaw Gromala
, Sukwon Choi
, Damena Agonafer
, Patrick Mccluskey

Mechanical Engineering

Research output: Contribution to journal › Editorial › peer-review

Original language	English (US)
Article number	010301
Journal	Journal of Electronic Packaging
Volume	145
Issue number	1
DOIs	https://doi.org/10.1115/1.4056558
State	Published - Mar 1 2023

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Mechanics of Materials
Computer Science Applications
Electrical and Electronic Engineering

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10.1115/1.4056558

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title = "Special Section on InterPACK2021",

author = "Jin Yang and Przemyslaw Gromala and Sukwon Choi and Damena Agonafer and Patrick Mccluskey",

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day = "1",

doi = "10.1115/1.4056558",

language = "English (US)",

volume = "145",

journal = "Journal of Electronic Packaging",

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publisher = "American Society of Mechanical Engineers (ASME)",

number = "1",

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T1 - Special Section on InterPACK2021

AU - Yang, Jin

AU - Gromala, Przemyslaw

AU - Choi, Sukwon

AU - Agonafer, Damena

AU - Mccluskey, Patrick

PY - 2023/3/1

Y1 - 2023/3/1

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M3 - Editorial

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VL - 145

JO - Journal of Electronic Packaging

JF - Journal of Electronic Packaging

IS - 1

M1 - 010301

ER -

Special Section on InterPACK2021

All Science Journal Classification (ASJC) codes

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