TY - GEN
T1 - Steep slope 2D strain field effect transistor
T2 - 2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018
AU - Schulman, Daniel
AU - Arnold, Andrew
AU - Das, Saptarshi
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/7/3
Y1 - 2018/7/3
N2 - Numerous advancements have allowed continuous aggressive dimensional scaling of CMOS to the current state of the art 10nm node but none are solutions to the fundamental Boltzmann statistics limits which have stalled Dennard voltage scaling. The semiconductor industry has invested heavily in disruptive, 'steep slope' transistor technologies which promise lower operating voltages and dramatically reduced power consumption. While many of these technologies show great promise such as Tunnel FETs, Phase Change FETs, and even nanomechanical switches, all are far from commercialization and large-scale integration due to issues ranging from poor ON currents, limited switching ranges and reliability[4, 5].
AB - Numerous advancements have allowed continuous aggressive dimensional scaling of CMOS to the current state of the art 10nm node but none are solutions to the fundamental Boltzmann statistics limits which have stalled Dennard voltage scaling. The semiconductor industry has invested heavily in disruptive, 'steep slope' transistor technologies which promise lower operating voltages and dramatically reduced power consumption. While many of these technologies show great promise such as Tunnel FETs, Phase Change FETs, and even nanomechanical switches, all are far from commercialization and large-scale integration due to issues ranging from poor ON currents, limited switching ranges and reliability[4, 5].
UR - http://www.scopus.com/inward/record.url?scp=85050461941&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85050461941&partnerID=8YFLogxK
U2 - 10.1109/VLSI-TSA.2018.8403841
DO - 10.1109/VLSI-TSA.2018.8403841
M3 - Conference contribution
AN - SCOPUS:85050461941
T3 - 2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018
SP - 1
EP - 2
BT - 2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 16 April 2018 through 19 April 2018
ER -