Study of electrical and mechanical characteristics of inkjet-printed patch antenna under uniaxial and biaxial bending

Yi Zhou, Sridhar Sivapurapu, Rui Chen, Nahid Aslani Amoli, Mohamed Bellaredj, Madhavan Swaminathan, Suresh K. Sitaraman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Scopus citations

Abstract

This paper discusses the electrical and mechanical characterization of an inkjet-printed patch antenna under uniaxial and biaxial bending. A 30 mm × 40 mm patch antenna design with a truncated copper ground plane was designed and fabricated by inkjet printing on a polyethylene terephthalate (PET) substrate. The fabricated antenna samples were then fixtured on cylindrical polycarbonate mandrels as well as on 3D printed saddle-like structures using polylactic acid (PLA). S11 was measured in both bent and flat configurations, and a shift in resonant frequency was observed. A maximum decrease of about 12.6% in resonant frequency under cylindrical bending was observed, and this decrease can be attributed to the decrease in conductance in the printed components due to small radius of some of the mandrels and due to sequential repetitive bending. The change in resonant frequency under biaxial saddle-like bending was small due to larger radii of the saddle-like surfaces and due to one-time bending. Electrical simulations in ANSYSTM HFSS were carried out to determine S11 of the patch antenna under flat configuration and was compared favorably against experimental data. Mechanical finite-element models in ANSYSTM Workbench were carried out to determine the strain distribution under both uniaxial and biaxial bending. A maximum strain of 0.0169 under uniaxial bending and 0.0029 under biaxial bending was observed.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1939-1945
Number of pages7
ISBN (Electronic)9781728114989
DOIs
StatePublished - May 2019
Event69th IEEE Electronic Components and Technology Conference, ECTC 2019 - Las Vegas, United States
Duration: May 28 2019May 31 2019

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2019-May
ISSN (Print)0569-5503

Conference

Conference69th IEEE Electronic Components and Technology Conference, ECTC 2019
Country/TerritoryUnited States
CityLas Vegas
Period5/28/195/31/19

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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