Substrate Integrated Waveguides in Glass Interposers for mm Wave Applications

Mutee Ur Rehman, Atom Watanabe, Siddharth Ravichandran, Madhavan Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Scopus citations

Abstract

This paper presents the first demonstration of Substrate Integrated Waveguides in glass interposers operating in D-band (110 GHz to 170 GHz) for mmWave applications. The material stack-up consists of 100 μmthick AGC ENA1 glass core laminated with 15 μm thick Ajinomoto Build up Films (ABF GL102) on both sides. The stack-up has been metallized using a newly developed Semi Additive Process (SAP). SIWs have been fed using broadband microstrip taper transitions. Conductor Backed Coplanar Waveguide (CBCPW) to microstrip transitions were designed to probe the samples. Cascade Infinity Probes (170-S-GSG-75-BT) were used for the electrical measurements. The measured insertion loss of glass based SIWs varies from 0.5dB/mm to 1 dB/mm in the entire D-band. For most of the frequencies it varies in the range of 0.5-0.8 dB/mm. The performance of glass interposer based SIWs has been compared with SIWs in LCP and silicon interposer.

Original languageEnglish (US)
Title of host publication2021 IEEE MTT-S International Microwave Symposium, IMS 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages339-341
Number of pages3
ISBN (Electronic)9781665403078
DOIs
StatePublished - Jun 7 2021
Event2021 IEEE MTT-S International Microwave Symposium, IMS 2021 - Virtual, Atlanta, United States
Duration: Jun 7 2021Jun 25 2021

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
Volume2021-June
ISSN (Print)0149-645X

Conference

Conference2021 IEEE MTT-S International Microwave Symposium, IMS 2021
Country/TerritoryUnited States
CityVirtual, Atlanta
Period6/7/216/25/21

All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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