Surface methodology for 3D printed multispectral systems

Joshua C. Davidson, Andrew D. O'Neill, Timothy J. Kane, Ram M. Narayanan

Research output: Chapter in Book/Report/Conference proceedingConference contribution


In this study, a methodology is developed to enhance additively manufactured surfaces for use as 3D printed optical mirrors. Utilizing vacuum deposition and pulse-reverse-current electroplating, a grain size smaller than one-tenth the wavelength can be achieved for mmWave, IR, visible, and UV. A shared-aperture, multispectral imaging system consisting of 3D printed optical mirrors is proposed for military and security applications. Being centered and aligned along the same optical axis provides the advantage of exploiting multi-beam target illumination while maintaining a consistent reference for image processing. With the use of additive manufacturing and surface treatment techniques, complex designs can be achieved to develop passive apertures with predictable resolution and dimensional tolerance. Optimization and integration of this surface methodology would enable the ability to additively manufacture multispectral optical systems.

Original languageEnglish (US)
Title of host publicationImage Sensing Technologies
Subtitle of host publicationMaterials, Devices, Systems, and Applications VI
EditorsNibir K. Dhar, Achyut K. Dutta, Sachidananda R. Babu
ISBN (Electronic)9781510626256
StatePublished - 2019
EventImage Sensing Technologies: Materials, Devices, Systems, and Applications VI 2019 - Baltimore, United States
Duration: Apr 15 2019Apr 16 2019

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X


ConferenceImage Sensing Technologies: Materials, Devices, Systems, and Applications VI 2019
Country/TerritoryUnited States

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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