System level signal and power integrity analysis methodology for system-in-package applications

Rohan Mandrekar, Krishna Bharath, Krishna Srinivasan, Ege Engin, Madhavan Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Scopus citations

Abstract

This paper describes a methodology for performing system level signal and power integrity analyses of SiP-based systems. The paper briefly outlines some new modeling and simulation techniques that have been developed to enable the proposed methodology. Some results based on the application of this methodology on test systems are also presented.

Original languageEnglish (US)
Title of host publication2006 43rd ACM/IEEE Design Automation Conference, DAC'06
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1009-1012
Number of pages4
ISBN (Print)1595933816, 1595933816, 9781595933812
DOIs
StatePublished - 2006
Event43rd Annual Design Automation Conference, DAC 2006 - San Francisco, CA, United States
Duration: Jul 24 2006Jul 28 2006

Publication series

NameProceedings - Design Automation Conference
ISSN (Print)0738-100X

Conference

Conference43rd Annual Design Automation Conference, DAC 2006
Country/TerritoryUnited States
CitySan Francisco, CA
Period7/24/067/28/06

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering

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