System-on-a-Package (SOP) module development for a digital, RF and optical mixed signal integrated system

K. Lim, L. Wan, D. Guidotti, V. Sundaram, G. White, F. Liu, S. Bhattacharya, R. Doraiswami, Y. J. Chang, J. Yu, S. Sarkar, R. Pratap, S. W. Yoon, M. Maeng, S. Pinel, J. Laskar, M. Tentzeris, G. K. Chang, M. Swaminathan, R. Tummala

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Engineering

Earth and Planetary Sciences

Material Science