System-on-a-Package (SOP) module development for a digital, RF and optical mixed signal integrated system

K. Lim, L. Wan, D. Guidotti, V. Sundaram, G. White, F. Liu, S. Bhattacharya, R. Doraiswami, Y. J. Chang, J. Yu, S. Sarkar, R. Pratap, S. W. Yoon, M. Maeng, S. Pinel, J. Laskar, M. Tentzeris, G. K. Chang, M. Swaminathan, R. Tummala

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