System-on-a-Package (SOP) substrate and module with digital, RF and optical integration

Venky Sundaram, Rao Tummala, George White, Kyutae Lim, Lixi Wan, Daniel Guidotti, Fuhan Liu, Swapan Bhattacharya, Raj M. Pulugurtha, Isaac Robin Abothu, Ravi Doraiswami, Raghuram V. Pucha, Joy Laskar, Manos Tentzeris, G. K. Chang, Madhavan Swaminathan

Research output: Contribution to journalConference articlepeer-review

9 Scopus citations


The Packaging Research Center has been developing next generation system-on-a-package (SOP) technology with digital, RF, and optical system integration on a single package. SOP aims to utilize the best of on-chip SOC integration and package integration to achieve highest system performance at the lowest cost. The microminiaturized multifunctional SOP package is highly integrated and fabricated on large area substrates similar to the wafer-to-IC concept. In addition to novel mixed signal design methodologies, SOP research at PRC is targeted at developing enabling technologies for package level integration including ultra-high density wiring, embedded passive components, embedded optical interconnects, wafer level packaging and fine pitch assembly. Several of these enabling technologies have been recently integrated into the first successful system level demonstration of SOP technology using the Intelligent Network Communicator (INC) testbed. This paper reports on the latest INC and SOP testbed results at the PRC and provides an insight into the future SOP integration strategy for convergent microsystems. The focus of this paper is on integration of materials, processes and structures in a single package substrate for System-on-a-Package (SOP) implementation.

Original languageEnglish (US)
Pages (from-to)17-23
Number of pages7
JournalProceedings - Electronic Components and Technology Conference
StatePublished - 2004
Event2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States
Duration: Jun 1 2004Jun 4 2004

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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